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AI optimized design, thermal resistance reduced by 2.3C / 100W, Asetek cooperates with Fabric8Labs to launch new cold head
AI optimized design, thermal resistance reduced by 2.3C / 100W, Asetek cooperates with Fabric8Labs to launch new cold head
News from this site on June 3, water cooling solution provider Asetek announced its cooperation with metal 3D printing company Fabric8Labs, launched a new AI-optimized cold head, which will be launched on the Asus ROG at Computex 2024 Taipei International Computer Show. Exhibition booth.
Compared with previous generations of water cooling solutions, the AI-optimized cold head uses artificial intelligence and ECAM additive manufacturing technology to optimize fluid dynamics , improving heat dissipation performance in an "unprecedented" way.
According to reports, the official used complex AI simulation tools to construct the entire cold head structure. The fins are different in design and can only be manufactured using 3D printing processes. .
This site noticed that compared with Asetek’s eighth-generation solution, the original AI-optimized cold head design can reduce the thermal resistance by up to 2.3C / 100W.
Asetek announced that it will showcase new AI optimizations at the booth of DIY core partner ASUS ROG Water block , the specific launch time of the end product has not been announced yet.
The above is the detailed content of AI optimized design, thermal resistance reduced by 2.3C / 100W, Asetek cooperates with Fabric8Labs to launch new cold head. For more information, please follow other related articles on the PHP Chinese website!
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