Home Technology peripherals It Industry Intel explains in detail the Intel 3 process: applying more EUV lithography, increasing the frequency of the same power consumption by up to 18%

Intel explains in detail the Intel 3 process: applying more EUV lithography, increasing the frequency of the same power consumption by up to 18%

Jun 19, 2024 pm 10:53 PM
Intel Advanced process Intel 3

According to news from this site on June 19, as part of the 2024 IEEE VLSI seminar activities, Intel recently introduced the technical details of the Intel 3 process node on its official website.

Intel's latest generation of FinFET transistor technology is Intel's latest generation of FinFET transistor technology. Compared with Intel 4, it has added steps to use EUV. It will also be a node family that provides foundry services for a long time, including basic Intel 3 and three variant nodes.

英特尔详解 Intel 3 工艺:应用更多 EUV 光刻,同功耗频率提升至多 18%

Among them, Intel 3-E natively supports 1.2V high voltage, which is suitable for the manufacturing of analog modules; and the future Intel 3-PT will further improve overall performance and supports finer 9μm pitch TSV and hybrid bonding.

Intel claims that as its "ultimate FinFET process", Intel 3-PT will become the mainstream choice for many years to come, and will be used by internal and external foundry customers together with angstrom-level process nodes.

Compared with Intel3, which only contains 240nm high-performance libraries (note on this site: HP libraries), the Intel4 process introduces the 210nm high-density (HD) library, providing more possibilities in transistor performance orientation.

英特尔详解 Intel 3 工艺:应用更多 EUV 光刻,同功耗频率提升至多 18%

Intel stated that its basic Intel 3 process can be improved at most compared to the Intel 4 process when using high-density libraries 18% frequency.

In addition, Intel also claimed that

the basic version of Intel 3 process density has also increased by 10%, achieving a "full node" level improvement.

英特尔详解 Intel 3 工艺:应用更多 EUV 光刻,同功耗频率提升至多 18%
As for the metal wiring layer on the transistor,

Intel 3 also provides 12+ in addition to the 14+2 layer of Intel 4 Two new options, 2 and 19+2, are targeted at low-cost and high-performance applications respectively.

英特尔详解 Intel 3 工艺:应用更多 EUV 光刻,同功耗频率提升至多 18%
Specifically for each metal layer, Intel maintains the same spacing as Intel 4 on key layers such as M0 and M1 of Intel 3 , mainly reducing the spacing between M2 and M4 from 45nm to 42nm.

The above is the detailed content of Intel explains in detail the Intel 3 process: applying more EUV lithography, increasing the frequency of the same power consumption by up to 18%. For more information, please follow other related articles on the PHP Chinese website!

Statement of this Website
The content of this article is voluntarily contributed by netizens, and the copyright belongs to the original author. This site does not assume corresponding legal responsibility. If you find any content suspected of plagiarism or infringement, please contact admin@php.cn

Hot Article Tags

Notepad++7.3.1

Notepad++7.3.1

Easy-to-use and free code editor

SublimeText3 Chinese version

SublimeText3 Chinese version

Chinese version, very easy to use

Zend Studio 13.0.1

Zend Studio 13.0.1

Powerful PHP integrated development environment

Dreamweaver CS6

Dreamweaver CS6

Visual web development tools

SublimeText3 Mac version

SublimeText3 Mac version

God-level code editing software (SublimeText3)

Intel Core Ultra 9 285K processor exposed: CineBench R23 multi-core running score is 18% higher than i9-14900K Intel Core Ultra 9 285K processor exposed: CineBench R23 multi-core running score is 18% higher than i9-14900K Jul 25, 2024 pm 12:25 PM

Intel Core Ultra 9 285K processor exposed: CineBench R23 multi-core running score is 18% higher than i9-14900K

Intel N250 low-power processor exposed: 4 cores, 4 threads, 1.2 GHz frequency Intel N250 low-power processor exposed: 4 cores, 4 threads, 1.2 GHz frequency Jun 03, 2024 am 10:26 AM

Intel N250 low-power processor exposed: 4 cores, 4 threads, 1.2 GHz frequency

Intel announces Wi-Fi 7 BE201 network card, supports CNVio3 interface Intel announces Wi-Fi 7 BE201 network card, supports CNVio3 interface Jun 07, 2024 pm 03:34 PM

Intel announces Wi-Fi 7 BE201 network card, supports CNVio3 interface

MSI launches new MS-C918 mini console with Intel Alder Lake-N N100 processor MSI launches new MS-C918 mini console with Intel Alder Lake-N N100 processor Jul 03, 2024 am 11:33 AM

MSI launches new MS-C918 mini console with Intel Alder Lake-N N100 processor

ASUS releases BIOS update for Z790 motherboards to alleviate instability issues with Intel's 13th/14th generation Core processors ASUS releases BIOS update for Z790 motherboards to alleviate instability issues with Intel's 13th/14th generation Core processors Aug 09, 2024 am 12:47 AM

ASUS releases BIOS update for Z790 motherboards to alleviate instability issues with Intel's 13th/14th generation Core processors

Intel Panther Lake mobile processor specifications exposed: up to '4+8+4' 16-core CPU, 12 Xe3 core display Intel Panther Lake mobile processor specifications exposed: up to '4+8+4' 16-core CPU, 12 Xe3 core display Jul 18, 2024 pm 04:43 PM

Intel Panther Lake mobile processor specifications exposed: up to '4+8+4' 16-core CPU, 12 Xe3 core display

Samsung Electronics reiterates that the SF1.4 process is expected to be mass-produced in 2027 and plans to enter the field of co-packaging optics Samsung Electronics reiterates that the SF1.4 process is expected to be mass-produced in 2027 and plans to enter the field of co-packaging optics Jun 13, 2024 pm 05:10 PM

Samsung Electronics reiterates that the SF1.4 process is expected to be mass-produced in 2027 and plans to enter the field of co-packaging optics

Intel explains in detail the Intel 3 process: applying more EUV lithography, increasing the frequency of the same power consumption by up to 18% Intel explains in detail the Intel 3 process: applying more EUV lithography, increasing the frequency of the same power consumption by up to 18% Jun 19, 2024 pm 10:53 PM

Intel explains in detail the Intel 3 process: applying more EUV lithography, increasing the frequency of the same power consumption by up to 18%

See all articles