HMD Fusion modular mobile phone configuration leaked: Qualcomm QCM6490, 100 million pixels, Pogo Pin interface

On June 22, blogger HMD_MEME'S released more detailed configuration information and renderings of the HMDFusion modular mobile phone.

HMD Fusion configuration summary: SoC: Qualcomm QCM6490, based on 778G Screen: 6.6-inch FHD+ 120Hz LCD Camera: 108MP + 2MP, front-facing 16MP Memory: 8GB + 256GB Battery: 4800mAh, supports 30W charging Size : 164mm x 76mm x 8.6mm, weight 200gOthers: Wi-Fi 6E, 3.5mm headphone jack, power fingerprint 2-in-1, Pogo Pin expansion interfaceNoted that HMD will provide a variety of Pogo models for Fusion phones Mobile phone case with pin interface expansion capability. According to the development document information, among the 6 Pogo Pin metal contacts on the back of HMD Fusion, the first 5 are used to implement USB 2.0 support, and the latter one is used for ADC detection. Related reading: "Including Lumia "replica mobile phone"/Fusion modular model, HMD's new phone prices/more renderings exposed""HMD releases Fusion mobile phone development documents: back pogo pin contact support module Third-party accessories》

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