On July 3, according to media reports, iPhone 16 is testing Samsung’s 48-megapixel sensor main camera. Looking back on previous models, the iPhone usually uses Sony's CIS, but since last year, there have been some problems with the cooperation between the two parties. According to reports, because Sony failed to deliver a new image sensor in time, making it difficult to determine the launch time of the iPhone 15, Apple asked Samsung to develop a new image sensor to prepare for the iPhone 16. It is reported that the Samsung sensor used in the iPhone 16 adopts a three-wafer stack design. The three wafers contain different components: photodiodes, transistors and analog-to-digital converters. The three-wafer stacking design enables electrical interconnection between different wafer layers. Compared with traditional two-layer stacking, wafer-level three-dimensional integration technology can simultaneously increase transmission speed, reduce latency, and bring higher performance with lower power consumption. It is worth noting that the iPhone 16 is also equipped with a camera button to allow users to record images more conveniently. As usual, iPhone 16 will be launched in September this year.
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