It is reported that Samsung Electronics has once again reorganized the HBM memory team and adjusted the advanced packaging organizational structure

PHPz
Release: 2024-07-11 17:12:10
Original
877 people have browsed it

According to news from this site on July 8, Korean media ZDNet Korea and ETNews reported that Samsung Electronics’ Device Solutions (DS) Department has recently reorganized its HBM memory and AVP advanced packaging departments. This is also a large-scale organizational restructuring after Jeon Young-hyun replaced Kyung Kyu-hyun as the head of the DS department in May.

消息称三星电子再度重组 HBM 内存团队,调整先进封装组织结构


▲ Samsung Electronics, the headquarters of Samsung Electronics in Suwon, previously established an HBM production capacity and quality improvement team, which is responsible for the development of HBM4, in parallel with the original HBM team.
The newly established "HBM Development Team" will be headed by Son Young-Soo, vice president of Samsung Electronics and expert in high-performance DRAM product design.
This new team will replace the previous two teams and take over the development of HBM3E and HBM4 memories, focusing manpower and material resources on catching up with the leader SK Hynix in the HBM business.
Samsung Electronics has been actively pushing for its HBM3E memory to pass Nvidia's testing in order to get a share of high-value HBM3E orders from the largest HBM buyer, but this goal has not yet been achieved.

消息称三星电子再度重组 HBM 内存团队,调整先进封装组织结构

Samsung Electronics also renamed the advanced packaging business team as "AVP Development Team", split the sales and marketing organization of the original team into various business departments, and merged HBM packaging developers into the HBM development team to improve the latter Competitiveness.
The renamed AVP development team will focus on the research and development of advanced packaging.
In addition, Samsung Electronics has also decided to reorganize the Equipment Technology Research Institute to strengthen the technical support capabilities of semiconductor processes and equipment, and provide broader technical support for improving the efficiency of semiconductor processes.

The above is the detailed content of It is reported that Samsung Electronics has once again reorganized the HBM memory team and adjusted the advanced packaging organizational structure. For more information, please follow other related articles on the PHP Chinese website!

source:ithome.com
Statement of this Website
The content of this article is voluntarily contributed by netizens, and the copyright belongs to the original author. This site does not assume corresponding legal responsibility. If you find any content suspected of plagiarism or infringement, please contact admin@php.cn
Popular Tutorials
More>
Latest Downloads
More>
Web Effects
Website Source Code
Website Materials
Front End Template
About us Disclaimer Sitemap
php.cn:Public welfare online PHP training,Help PHP learners grow quickly!