According to news from this site on July 8, Korean media ZDNet Korea and ETNews reported that Samsung Electronics’ Device Solutions (DS) Department has recently reorganized its HBM memory and AVP advanced packaging departments. This is also a large-scale organizational restructuring after Jeon Young-hyun replaced Kyung Kyu-hyun as the head of the DS department in May.
▲ Samsung Electronics, the headquarters of Samsung Electronics in Suwon, previously established an HBM production capacity and quality improvement team, which is responsible for the development of HBM4, in parallel with the original HBM team.
The newly established "HBM Development Team" will be headed by Son Young-Soo, vice president of Samsung Electronics and expert in high-performance DRAM product design.
This new team will replace the previous two teams and take over the development of HBM3E and HBM4 memories, focusing manpower and material resources on catching up with the leader SK Hynix in the HBM business.
Samsung Electronics has been actively pushing for its HBM3E memory to pass Nvidia's testing in order to get a share of high-value HBM3E orders from the largest HBM buyer, but this goal has not yet been achieved.
Samsung Electronics also renamed the advanced packaging business team as "AVP Development Team", split the sales and marketing organization of the original team into various business departments, and merged HBM packaging developers into the HBM development team to improve the latter Competitiveness.
The renamed AVP development team will focus on the research and development of advanced packaging.
In addition, Samsung Electronics has also decided to reorganize the Equipment Technology Research Institute to strengthen the technical support capabilities of semiconductor processes and equipment, and provide broader technical support for improving the efficiency of semiconductor processes.
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