According to news from this website on July 13, Korean media businesskorea reported that NVIDIA, TSMC and SK Hynix will form a "triangular alliance" to jointly promote next-generation technologies such as HBM4 to welcome the AI era. SEMI plans to hold the SEMICON event on September 4 this year (its influence can be considered the CES show of the semiconductor industry). More than 1,000 companies, including TSMC, will showcase the latest semiconductor equipment and technology, promoting cooperation and innovation. The main focus of the conference is expected to be the next generation of HBM, specifically the revolutionary HBM4 memory, which will usher in a new era in the market. This site quoted the media report that SK Hynix President Kim Joo-sun will deliver a keynote speech at the CEO Summit of this event. This is the first time that the company has played such an important role in this event. Reports say that after Kim Joo-sun's speech, he will discuss the next-generation high-bandwidth memory (HBM) cooperation plan with TSMC executives; in addition, he will hold a roundtable discussion with NVIDIA to further consolidate the triangular alliance between SK Hynix, TSMC and NVIDIA. . Reports indicate that SK Hynix has reached a cooperation with TSMC to jointly design and produce some products of the "HBM4 (sixth generation)" series, and plans to start mass production in 2026; Nvidia provides product design.
SK Hynix is also expected to demonstrate the latest research results of HBM4 at this event. After using TSMC’s advanced process and packaging technology, power consumption can be reduced by more than 20% compared to the original target.The above is the detailed content of NVIDIA, TSMC and SK Hynix deepen triangular alliance: HBM4 memory will be mass-produced in 2026 and power consumption will be reduced by 20% compared with the original target. For more information, please follow other related articles on the PHP Chinese website!