Innolux plans to mass-produce fan-out panel-level semiconductor packaging technology by the end of the year

According to news from this website on August 6, Yang Zhuxiang, general manager of Innolux Corporation, said yesterday (August 5) that the company is actively deploying and promoting semiconductor fan-out panel-level packaging (FOPLP), which is expected to be implemented this year Chip First process technology will be mass-produced before the end of the year, and its contribution to revenue will be apparent in the first quarter of next year. fenye
Innolux stated that it is expected to mass-produce the redistribution layer (RDL First) process technology for mid-to-high-end products in the next 1-2 years, and will work with partners to develop the most technically difficult glass drilling (TGV) process, which will take 2 more years -3 years to put into mass production.
Yang Zhuxiang said that Innolux’s FOPLP technology is “ready for mass production” and will enter the market with mid- to low-end products and gradually expand to mid-to-high-end products in the future.
Note from this site: Innolux Corporation (English: Innolux Corporation), referred to as Innolux, was established in 2003 and is one of the top five panel manufacturers.

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