Thanks to netizen South China Wu Yanzu for submitting the clue! According to news on August 9, a new realme phone with model number RMX5000 appeared on the GeekBench benchmark testing platform on July 31. It is expected to be the upcoming Realme 13+ mobile phone.
Dimensity 7300 and Dimensity 7300X are both built on TSMC’s 4nm process. The CPU part is an eight-core architecture composed of 4 Cortex-A78 clocked at 2.5GHz and 4 Cortex-A55, equipped with Arm Mali-G615 MC2 GPU, supporting LPDDR4x, LPDDR5 memory + UFS 3.1 flash memory.
In addition, the two processors support Wi-Fi 6E, Bluetooth 5.4, support 5G dual-card technology, and support dual-card VoNR; integrated AI processor APU 655, AI performance is 2 times that of Dimensity 7050.
For more configuration information about realme 13+ mobile phone, interested friends can pay attention to follow-up reports.
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