Sharp is considering selling its semiconductor and camera module businesses to Hon Hai for an undisclosed amount

According to news from this website on August 12, Sharp announced on August 9 that it is considering selling its semiconductor business and smartphone camera module business to Hon Hai within this fiscal year. Regarding the sale amount, Sharp President Masahiro Okitsu said that since the negotiations have just begun, it is not convenient to disclose more details at the moment.

▲ Source: Sharp This site noticed that as early as July 11, there were reports that Foxconn Group has entered the advanced packaging field, focusing on the current mainstream panel-level fan-out packaging (FOPLP) semiconductor solution. Following its subsidiary Innolux, Sharp, invested by Foxconn Group, also announced its entry into Japan's panel-level fan-out packaging field and is expected to go into production in 2026.
Public information shows that Foxconn Group currently holds 10.5% of Sharp’s shares. The group stated that it will not increase or reduce its holdings at this stage and will maintain the existing investment relationship.
Sharp passed a resolution at its regular shareholders’ meeting and board of directors meeting on June 27, deciding to adopt the new system. Sharp said that the company will strengthen corporate governance and promote a light asset strategy through a board of directors including six independent external directors, and will appoint Hon Hai Chairman Liu Yangwei as non-executive chairman to strengthen medium- and long-term development cooperation with Hon Hai.

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