News from this site on August 16, Seoul Economic Daily reported yesterday (August 15) that Samsung will install the first High-NA EUV lithography machine from ASML between the fourth quarter of 2024 and the first quarter of 2025. , and is expected to be put into use in mid-2025.
It is reported that Samsung will install the first ASML Twinscan EXE:5000 High-NA lithography machine in its Hwaseong campus, mainly for research and development purposes to develop next-generation manufacturing technology for logic and DRAM.
Samsung plans to develop a strong ecosystem around High-NA EUV technology: In addition to acquiring high-NA EUV lithography equipment, Samsung is also collaborating with Japan's Lasertec Corporation to develop inspection equipment specifically for High-NA photomasks.
This site quoted DigiTimes as reporting that Samsung has purchased Lasertec’s High-NA EUV mask inspection tool Actis A300.
1. Dr. Min Cheol-ki of Samsung Electronics Semiconductor Research Institute said at the 2024 Lithography and Patterning Symposium: “Compared with traditional [EUV-specific tools], using [High-NA EUV dedicated tools] Inspecting semiconductor masks can increase contrast by more than 30%."
- The report also said that Samsung is also working with photoresist manufacturer JSR and etching machine manufacturer Tokyo Electronics to prepare to put Gaona EUV tools into commercial applications by 2027.
- Samsung is also working with Synopsys to move from traditional circuit designs to curved patterns on photomasks. This shift is expected to improve the precision with which circuits are imprinted on wafers, which is critical to further improving the process technology.
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