It is reported that Xiaomi MIX Flip mobile phone has a dual-hole digging module on the rear and is equipped with Snapdragon 8 Gen 3

IT House reported on February 16th that blogger @ Smart Pikachu today brought the latest news about Xiaomi’s vertical small folding device, which is expected to be named Xiaomi MIX Flip.

Revealing content

1. Xiaomi MIX Flip has a minimalist style, a rear dual hole-punch module, equipped with a 3x vertical telephoto lens, the secondary screen has a dedicated software-defined module, and is equipped with Snapdragon 8 Gen 3 Processor, supports macro shooting.

2.@digitalchat.com revealed that Xiaomi’s vertically foldable mobile phone uses a domestically produced screen with “zero crease”. The dual camera module and secondary screen are simple in design. The main camera is a 50M outsole, supplemented by Upright telephoto lens.

Xiaomi’s large foldable model is equipped with the flagship 50M periscope quad camera. Both new machines support the Snapdragon 8 Gen 3 processor and satellite communication functions, adopt an "extremely thin and light" design, and the screen fast charging peripherals are not castrated.

Currently, Samsung, Huawei, OPPO, and vivo have all adopted the dual-line parallel strategy of "big folding + small folding", while Xiaomi and Honor have only launched "big folding" phones. The launch of Xiaomi MIX Flip will provide users with more choices.

Currently, Xiaomi has not revealed the release time of this new phone.

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