According to news on May 18, senior leaders of the Japanese semiconductor industry held a meeting at the Japanese official residence this morning. Major participants in the meeting included Japanese Prime Minister and TSMC Chairman Liu Deyin, Intel CEO Pat Gelsinger, Micron CEO Sanjay Mehrotra, Samsung Electronics CEO Qing Guixian, IBM Senior Vice President Dario Gil, Prabu Raja, President of Applied Materials Semiconductor Products Group, Max Mirgoli, Executive Vice President of IMEC and other important figures in the industry.
According to Reuters, the Japanese government encourages companies to increase direct investment in Japan, and the Ministry of Economy, Trade and Industry will provide assistance to the semiconductor industry. At the press conference after the meeting, Yasumi Nishimura, who participated in the meeting, said that Micron has proposed a mass production plan for the latest generation of DRAM at the Hiroshima factory in Japan, with a maximum investment of 500 billion yen (approximately 25.5 billion yuan). To promote investment in advanced semiconductors, the Japanese government will provide relevant support budgets. Investment in the semiconductor industry can receive 1.3 trillion yen (approximately 66.3 billion yuan) in budget subsidies.
Nishimura Yasumin also said at the press conference that Intel is expanding cooperation with Japanese semiconductor material factories and equipment factories on back-end processes.
In addition, Samsung Electronics also plans to set up a back-end process-related R&D center in Japan, and Applied Materials will strengthen cooperation with Rapidus, a Japanese advanced semiconductor manufacturer, to promote new product development and talent cultivation.
According to ITBEAR Technology Information, TSMC is currently building a wafer fab in Kumamoto Prefecture, Japan. During the talks, it was also mentioned that it would consider expanding investment in Japan based on customer demand and Japanese government subsidies.
Previous reports also mentioned that IMEC plans to set up an R&D center in Hokkaido, Japan, to assist Rapidus in developing mass production technology for the 2nm process.
In short, this meeting provided opportunities for the development of Japan’s semiconductor industry. Companies expressed their willingness to expand investment in the Japanese market and strengthen cooperation with local companies to promote technology research and development and innovation. This will further enhance the competitiveness of Japan's semiconductor industry in the global market.
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