Technology transcends! Rapidus plans to achieve mass production on 2nm process

Rapidus plans to reinvigorate the industry after lagging behind the state of the art in wafer manufacturing technology for more than 20 years. Aiming to achieve mass production of the 2-nanometer EUV process as quickly as possible by 2025, the company was jointly established with eight industry leaders including Toyota, Sony, and Renesas.

From the editor’s understanding, it is undoubtedly very challenging to directly jump from the current 45-nanometer level to the 2-nanometer process. Rapidus is partnering with IBM in the United States to license 2-nanometer technology.

Rapidus plans to send 100 engineers to IBM to learn the GAA surround gate transistor technology required to implement the 2nm process, which is considered one of the key technologies one. Before April, Rapidus had sent a team of engineers to discuss cooperation with IBM.

Rapidus plans to build a wafer fab in Hokkaido to achieve this goal. Construction work is expected to begin in September 2023, with the plant infrastructure completed and the construction of clean rooms launched by June 2024. The company plans to start trial operation of the production line in April 2025 and introduce EUV lithography machines and other equipment. Rapidus aims to start large-scale mass production of the 2nm process in 2027, which is only 1-2 years behind the 2nm processes of TSMC, Samsung and Intel.

In addition to committing to mass production of the 2-nanometer process, Rapidus has also formulated a plan to achieve annual revenue of 1 trillion yen in the 2030s, equivalent to approximately 51 billion RMB or US$7.2 billion in size.

Rapidus’ plan to revive the wafer manufacturing industry has attracted much attention. If mass production of the 2-nanometer process is successfully achieved, it will significantly promote the progress of Japan's semiconductor industry and enhance its competitiveness in the global semiconductor market.

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