SG10 chassis unveiled: Steacom creates a new era of heat control for 600W platform

News on June 1st, Steacom announced at Computex An eye-catching new product was displayed at the 2023 exhibition-SG10 chassis. The biggest highlight of this chassis is that it can handle up to 600W of heat without a fan, bringing users excellent cooling performance.

According to the editor’s understanding, Steacom had previewed this chassis as early as 2021 and launched crowdfunding on the Kickstarter platform in 2020. However, the crowdfunding campaign ultimately failed. However, at this major exhibition, Steacom announced that it will begin mass production of the SG10 chassis later this year, bringing a new user experience to the majority of users.

#The most eye-catching aspect of the SG10 chassis is its passive cooling design. According to the official introduction, the CPU part of the SG10 chassis can handle a maximum heat consumption of less than 250W, while the GPU part can handle a maximum power consumption of less than 350W. The top of the chassis is equipped with a symmetrical and solid double aluminum heat sink that occupies about one-third of the height. It is connected to the internal closed pump-less system through copper pipes to achieve the effect of cyclic evaporation and condensation.

During the exhibition, Steacom demonstrated a machine equipped with Intel Core i9-13900K processor and built-in Asus GeForce RTX The SG10 chassis with 4080 graphics card demonstrates its excellent performance and cooling capabilities. The advent of this chassis will provide a reliable and efficient solution for users of high-performance computers.

Overall, Steacom’s SG10 chassis brings a new cooling experience to users with its fanless cooling design and excellent heat handling capabilities. After launching the mass production plan, this chassis will definitely gain more attention and recognition in the market, thereby bringing users a better computer experience.

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