Home Technology peripherals It Industry Baode issued an official statement to clarify the chip OEM statement

Baode issued an official statement to clarify the chip OEM statement

Jun 03, 2023 pm 03:53 PM
Baode Core blast statement

Bodek Computer Systems Co., Ltd. has responded to the outside world regarding the "OEM chips" it launched. The response time is June 3. On May 31, Li Ruijie, chairman of Baode Company, issued an official statement on Weibo, clarifying some doubts and detailing the company's position.

Baode issued an official statement to clarify the chip OEM statement

According to Li Ruijie, Boyd Company’s first CPU chip core P3-01105 is a customized CPU product launched with the support of Intel Corporation and was launched in The public announcement was made at a product launch event on May 6. This chip is mainly intended for use in branded PC terminals in the commercial market, and has not applied for any national projects and subsidies at all levels. However, some voices questioned that the chip is only Intel A replica of the 10th generation Core entry-level i3-10105, which is an OEM product. Some people even worry that Baode Chip may become another "Hanxin".

In response to these doubts, Li Ruijie responded to the outside world’s questions through multiple Weibo posts. He said that before the development of Baode, Baode Company had already gone through the localization path from X86 to ARM, and then to RISC-V. Through this series of efforts, Baode tried to give the country the ability to independently control the source code, so as to Prevent chip backdoor attacks. He emphasized that Baode was not simply OEM, but stood on the shoulders of the Intel giant, solved the original code problems in its own way, and worked hard to make Baoxin unique.

According to the editor’s understanding, under the current development background of domestic chips, doubts about Baode’s exposed cores are not an isolated case. However, Boyd made it clear in its response that they will take one step at a time, adhere to the principle of not burning money and refusing to lose money, and steadily develop their own technology and products. Boyd hopes that through this process, it can gain independent innovation capabilities and provide reliable chip products for national security.

Baode issued an official statement to clarify the chip OEM statement

#The response from Boyd Computer Systems Co., Ltd. shows that they actively respond to market doubts and are committed to the development of their own technology. With the vigorous development of the domestic chip industry, Boyd will face more challenges and opportunities. Whether Boyd can stand out in the fierce competition in the future will depend on whether Boyd can continuously improve its R&D strength and product quality, and find a way out. The road to competitive domestic chips.

Li Ruijie, chairman of Baode Company, responded by emphasizing the company’s efforts in the field of localized chips and its determination to pursue independent innovation. They not only rely on OEM, but adhere to their own research and development routes and constantly seek breakthroughs. By standing on Intel's shoulders, Boyd hopes to overcome source code issues, achieve the goal of a two-in-one chip, and ensure national security controls source code to prevent the risk of chip backdoor attacks.

Baode Company faces many challenges due to the fierce competition in the domestic chip market. In addition to dealing with other outstanding domestic chip manufacturers, we also have to compete with international giants. Baode Company should improve its technical strength through independent research and development and innovation, rather than relying solely on OEM business, in order to provide competitive products in the market.

As the Chinese government encourages independent research and development and localization, the domestic chip industry is booming. As a domestic server manufacturer, Boyd faces huge market opportunities. To stand out in the fierce market competition, Baode needs to continue to strengthen technology research and development and improve product quality.


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