According to Taiwan's "Economic Daily" report, TSMC announced that in order to meet the market demand for advanced processes, the Kaohsiung plant will put into production planning and use 2-nanometer advanced process technology
TSMC said at the conference in April It was confirmed that the Kaohsiung factory would adjust the 28nm production line to a more advanced process technology, but it did not mention what process it would change to at the time. TSMC’s current 2-nanometer production bases have been planned for Zhuke and Zhongke. If Kaohsiung is included in the future, the company will have three 2-nanometer production bases.
In addition, according to Taiwan's "Central News Agency" news,TSMC plans to mass-produce the 2-nanometer process in 2025, using a nanosheet transistor structure. At the same time, TSMC has developed a backside rail solution at 2 nanometers, which is suitable for high-performance computing-related applications. It is targeted to be launched in the second half of 2025 and mass produced in 2026.
The total investment amount is estimated to exceed 10 billion euros, To provide advanced semiconductor manufacturing services.
TSMC will build the fab in the second half of 2024 and start production at the end of 2027. The plant will be operated by TSMC, which will hold a 70% stake, with Bosch, Infineon and NXP each holding 10%. It is expected that after completion, it will produce 40,000 300mm (12-inch) wafers per month, using TSMC's 28/22nm planar CMOS and 16/12nm FinFET process technology Articles on this site contain external jump links for the purpose We are providing more information to save selection time, but the results are for reference only. For specific content, please check the statement of this siteThe above is the detailed content of TSMC plans to expand three 2nm process plants by 2025 and is expected to start mass production. For more information, please follow other related articles on the PHP Chinese website!