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HBM memory shipments are expected to grow by 105% next year, with SK Hynix and Samsung accounting for approximately 95% of total shipments.

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Release: 2023-08-14 19:17:05
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According to news from this website on August 10, TrendForce recently released a report stating that due to increased orders for self-developed chips from Nvidia and other cloud service providers (CSPs), memory manufacturers are actively expanding their TSV production lines. In order to increase HBM production capacity, HBM shipments are expected to increase by 105% in 2024.

HBM memory shipments are expected to grow by 105% next year, with SK Hynix and Samsung accounting for approximately 95% of total shipments.
##The report points out that the mainstream demand in 2023 has shifted from HBM2e to HBM3

, and the demand proportion is estimated to be about 50% and 39%.

As acceleration chips using HBM3 continue to increase in volume, market demand will shift significantly to HBM3 in 2024,

and will directly surpass HBM2e in 2024, with the proportion estimated to reach 60%, And benefiting from its higher average selling price (ASP), it will drive significant growth in HBM's revenue next year.

HBM memory shipments are expected to grow by 105% next year, with SK Hynix and Samsung accounting for approximately 95% of total shipments.
From a competitive perspective, SK hynix’s HBM3 products currently lead other original manufacturers and are the main supplier of NVIDIA Server GPUs .

HBM memory shipments are expected to grow by 105% next year, with SK Hynix and Samsung accounting for approximately 95% of total shipments.
Samsung focuses on meeting orders from other cloud service providers. With additional orders from customers, this year’s market share is as high as that of SK Hynix. The gap will be significantly narrowed. From 2023 to 2024, the HBM market shares of the two companies are expected to be similar, and

together hold approximately 95% of the HBM market share.

It is expected that in the next two years, due to the large-scale production expansion plans of the two major Korean manufacturers, Micron will focus on developing HBM3e products and may suffer a slight decline in market share

Interested users can click to read. The original text of the report is attached to this site.

HBM is a high-performance DRAM based on 3D stacking technology. It is developed by Samsung Electronics, AMD and SK Hynix. Initiated, suitable for applications with high memory bandwidth requirements, such as graphics processors, network switching and forwarding equipment (such as routers, switches)

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