According to news from this website on August 10, TrendForce recently released a report stating that due to increased orders for self-developed chips from Nvidia and other cloud service providers (CSPs), memory manufacturers are actively expanding their TSV production lines. In order to increase HBM production capacity, HBM shipments are expected to increase by 105% in 2024.
, and the demand proportion is estimated to be about 50% and 39%.
As acceleration chips using HBM3 continue to increase in volume, market demand will shift significantly to HBM3 in 2024,and will directly surpass HBM2e in 2024, with the proportion estimated to reach 60%, And benefiting from its higher average selling price (ASP), it will drive significant growth in HBM's revenue next year.
together hold approximately 95% of the HBM market share.
It is expected that in the next two years, due to the large-scale production expansion plans of the two major Korean manufacturers, Micron will focus on developing HBM3e products and may suffer a slight decline in market shareInterested users can click to read. The original text of the report is attached to this site. HBM is a high-performance DRAM based on 3D stacking technology. It is developed by Samsung Electronics, AMD and SK Hynix. Initiated, suitable for applications with high memory bandwidth requirements, such as graphics processors, network switching and forwarding equipment (such as routers, switches) Statement on this site: This article contains external jump links and is intended to provide More information, save time sifting, results are for reference only, all articles carry this statementThe above is the detailed content of HBM memory shipments are expected to grow by 105% next year, with SK Hynix and Samsung accounting for approximately 95% of total shipments.. For more information, please follow other related articles on the PHP Chinese website!