Samsung plans to introduce BSPDN back power supply technology into 1.4nm process in 2027

According to ETNews, Jung Ki-tae Jung, chief technology officer of Samsung Electronics’ foundry department, announced at a recent forum that they plan to apply BSPDN technology to the 1.4nm process in 2027

Samsung Electronics’ first Disclosed the development process of its backside power supply (BSPDN) technology, which is an innovative technology used in advanced semiconductors to fully explore the potential of the backside space of the wafer, but it has not yet been implemented globally

Although the semiconductor industry no longer uses gate length and metal half pitch to name technology nodes, there is no doubt that the smaller the current process technology number, the more advanced it is.

With the progress of the semiconductor process shrinkage route, The distance between circuits within integrated circuits is getting smaller and smaller, causing interference with each other. However, with BSPDN technology, we can use the backside of the wafer to build power supply lines, thereby effectively separating the circuit and power supply space, overcoming this limitation

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In addition to Samsung Electronics, companies such as TSMC and Intel are also actively seeking technological breakthroughs. At the same time, Japan's Tokyo Electronics (TEL) and Austria's EV Group (EVG) currently provide BSPDN implementation equipment

Intel's latest technology is called PowerVia, which is designed to reduce power consumption, improve efficiency and performance. It is expected that in the first half of 2024, Intel's first node Intel 20A using PowerVia technology and RibbonFET all-around gate transistors will be ready and applied to future mass production of the Arrow Lake platform. Currently, the technology is undergoing its first step in the wafer fab

TSMC also plans to adopt similar technology in processes below 2nm, and plans to achieve the goal by 2026

According to market demand, Samsung Electronics The BSPDN technology target may be postponed to 2027 for application in the 1.4nm process

According to relevant sources at Samsung Electronics, the mass production time of semiconductors using backside power supply technology may be adjusted based on customer schedules. Samsung Electronics aims to mass-produce the 2nm process by 2025, earlier than the 1.4nm process. Currently, Samsung is conducting a customer demand survey to determine the application of back-side power supply technology

Read related information:

Intel has launched the latest PowerVia back-side power supply technology, which can reduce power consumption, Improving efficiency and performance

Samsung applied BSPDN technology to 2nm chips, improving performance by 44% and efficiency by 30%

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