SK hynix leads a new era of high-speed data processing in the AI ​​field: HBM3E technology is about to be released

News on August 21, today according to reliable sources, South Korean semiconductor manufacturer SK Hynix announced a major breakthrough and successfully developed a new high-performance DRAM product HBM3E for the field of artificial intelligence. This product will provide powerful data processing capabilities for AI applications and is expected to set off a new wave in the future computing field.

##HBM technology (High Bandwidth Memory) is no longer unfamiliar as an innovative technology that vertically connects multiple DRAM chips to increase data processing speed. The HBM3E this time is expanded and optimized on the basis of the previous generation product HBM3. It is reported that HBM3E shows amazing performance in terms of speed and can process up to 1.15TB of data per second, which is equivalent to completing the data processing of 230 full HD movies in just 1 second.

SK hynix stated that the research and development of HBM3E is based on its rich HBM manufacturing experience and its maturity in mass production. The company plans to start mass production of HBM3E in the first half of next year, which will further consolidate its leading position in the memory market for artificial intelligence.

It is worth mentioning that HBM3E has made breakthroughs in data processing speed and made innovations in heat dissipation performance. SK hynix's technical team adopted advanced MR-MUF technology to improve heat dissipation performance by 10% compared to the previous generation product. This technological innovation helps ensure the stable operation of the chip during high-intensity computing

According to the editor’s understanding, HBM3E products also have backward compatibility, which means that when building based on HBM3 In the system, new products can be directly applied without additional design or structural modifications, bringing greater convenience and flexibility to customers.

In terms of industrial cooperation, NVIDIA, a world-renowned semiconductor company, has also expressed great concern about the advent of HBM3E. Ian Buck, vice president of NVIDIA's Hyperscale and HPC division, said that NVIDIA and SK Hynix have a long history of cooperation in the HBM field. He looks forward to the two parties continuing to maintain close cooperation in the field of HBM3E and jointly promote the development of a new generation of AI computing solutions.

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