Sources say Samsung has secured AMD HBM3 memory orders to support its MI300X GPU

According to news from this site on August 23, according to foreign media hankyung, AMD has reached an agreement with Samsung Electronics. Samsung’s HBM3 memory and packaging technology will be adopted by AMD MI300X GPU. Foreign media expect that Samsung Electronics will launch the HBM market gained 50% share.

Currently, TSMC is currently heavily occupied by Nvidia’s huge AI GPU orders, which makes it difficult for companies such as AMD to entrust TSMC, so AMD needs to find another reliable and consistent partner - namely Samsung.

▲ Picture source Foreign media hankyung

It is reported that Samsung has passed the decisive quality test of its next-generation HBM3 memory , and is preparing to bring AMD into the mix. Foreign media claim that Samsung proposed a "hybrid" manufacturing process to Nvidia, such as wafer procurement to 2.5D packaging.

This site also discovered that in addition to AMD, Nvidia also considers Samsung as a potential supplier. It is said that "TSMC is currently unable to meet the huge demand in the AI ​​industry, and the delivery time has been extended by six months." With supply chains disrupted, profits will also be affected, and Nvidia aims to "maximize its production volume," which is something "Nvidia cannot afford."

▲ Picture source AMD

AMD MI300X has up to 8 XCD cores, 304 sets of CU units, and 8 sets of HBM3 cores. The video memory capacity has been increased to 192GB, which is equivalent to 2.4 times that of NVIDIA H100 80GB. At the same time, the HBM memory bandwidth is as high as 5.2TB/s, and the Infinity Fabric bus bandwidth is also 896GB/s, which is also higher than NVIDIA H100.

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