News on September 14th, MediaTek’s flagship mobile chip Dimensity 9300 is highly anticipated. Although there were previous rumors about its heating problem, the latest official response has clarified these doubts.
According to the latest news, the Dimensity 9300 chip will be officially unveiled in November this year and will be first installed in vivo On X100 series mobile phones. This news has been confirmed by MediaTek officials. At the same time, they also denied previous rumors about chip heating problems, saying that these rumors were baseless and did not seek confirmation from MediaTek.
It is understood that the Dimensity 9300 uses TSMC’s 4-nanometer process technology. This is an exciting technological advancement. It will be the first time in the Android camp to adopt the full Large-core CPU design, including four Cortex-X4 ultra-large cores and four Cortex-A720 large cores. In addition, Dimensity 9300 is also equipped with Arm’s latest flagship GPU-Immortalis-G720, which has significantly improved performance and energy efficiency. Industry insiders even believe that Dimensity 9300 is expected to challenge the CPU and GPU performance of Apple's A17 chip.
The release of Dimensity 9300 is highly anticipated, not only because of its excellent performance potential, but also because it will bring better performance and experience to vivo X100 series mobile phones . According to my understanding, the design and development of new products with customers are currently proceeding smoothly, and chips and customer terminal equipment are planned to be launched in the fourth quarter. Let's wait and see and look forward to more details being revealed
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