Intel confirms that it will introduce a new 3D stacked cache processor in the future to challenge AMD 3D V-Cache

According to news from this site on September 20, Intel CEO Pat Gelsinger revealed a lot of key information during the media Q&A session after the 2023 Innovation Event.

Although Intel will not directly adopt 3D cache like AMD, they confirmed that they will use stacked cache technology. However, the technology will not launch at the same time as Meteor Lake

Kissinger said: "When you mention V-Cache, you mean is a specific technology that TSMC is working with some customers on. Obviously, we are different in the makeup, right? And that specific type of technology is not part of Meteor Lake, but on our roadmap, you can Seeing the idea that we're going to have cache on the chip, we're going to do CPU computing on stacked chips, and that can obviously be combined into different functions using EMIB and Foveros." Very satisfied with having advanced technology in terms of memory architecture and having advantages in 3D stacking. Whether it is a small chip or a large packaged chip for AI and high-performance servers, we have a full range of technical capabilities. We will apply these technologies to our products and demonstrate to Foundry (IFS) customers

What he said makes sense, the source of AMD 3D V-Cache technology is TSMC's SoIC packaging technology. In addition, this chip architecture has been a long-term goal pursued by major chip manufacturers for many years

Of course, at this stage, the 3D stack cache can be said to be the unique advantage of AMD processors, which can provide X3D processing Powered by processors, these CPUs have become one of the most powerful gaming processors in the world, and can also bring high added value.

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