Kuixin Technology appears at the 2023 Global AI Chip Summit

(Global TMT September 18, 2023) On September 14-15, the 2023 Global AI Chip Summit (GACS 2023) was officially held in Shenzhen. Wang Xiaoyang, Vice President of Kuixin Technology, delivered a speech titled "High-Performance Internet Interface Solution to Drive Cloud/Edge Computing Power Construction". Wang Xiaoyang shared the chip interconnection trend triggered by the AIGC industry's computing power demand, analyzed the computing power chip bottleneck, and proposed Kuixin memory interconnection solutions and Chiplet implementation solutions.

Wang Xiaoyang, Vice President of Kuixin Technology, delivered a speech at the GACS 2023 Chip Architecture Innovation Session

Currently, the development of AIGC has promoted the rapid growth of computing power demand. However, due to the relative lag in the development speed of memory bandwidth and I/O bandwidth, large model training and inference face memory walls and I/O walls. In addition, when large models are deployed for inference in the future, memory capacity and bandwidth will be higher than the computing power and technology of the chip. For memory access-intensive tasks such as large model inference, the estimation of computing power requirements cannot only consider the demand for FLOPs. The more important bottleneck is memory bandwidth. Using Kuixin M2link interconnection solution can increase the HBM capacity in the package and increase the SOC. The effective usable computing power area.

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