TSMC responds to rumors of jointly developing silicon photonics technology with Broadcom, Nvidia and others

According to news from this site on September 11, silicon photonics and co-packaged optical components (CPO) have become new technologies in the industry. It is reported on the Internet that TSMC is working with major customers such as Broadcom and Huida to jointly develop it, and it will begin in the second half of next year at the earliest. Big order.

According to Taiwan's "Economic Daily" report, regarding related rumors, TSMC stated that it does not respond to customers and product status. However, TSMC is highly optimistic about silicon photonics technology. TSMC Vice President Yu Zhenhua recently publicly stated: "If we can provide a good silicon photonics integrated system, we can solve the two key issues of energy efficiency and AI computing power. This will be a new Paradigm shift. We may be at the beginning of a new era."

This site noticed that international semiconductor companies such as TSMC, Intel, Huida, and Broadcom Companies are beginning to make plans in silicon photonics and co-packaged optical component technologies. It is expected that the entire market will experience explosive growth as early as 2024

In industry analysis, pluggable optical components are still used for high-speed data transmission. . With the rapid development of transmission speed, we have entered the 800G era and are expected to further increase to higher transmission rates such as 1.6T to 3.2T in the future. However, power loss and heat dissipation management issues will become the biggest problems we face

Silicon photonics technology uses laser beams instead of electronic signals to transmit data, and is integrated into a single module through CPO packaging technology. It has now obtained Microsoft, Meta Wait for major manufacturers to certify and adopt it in the new generation network architecture.

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