3 nanometer process, performance surpasses H100!
Recently, according to foreign media DigiTimes, NVIDIA is developing the next generation of GPU, the B100 code-named "Blackwell"
It is said that as For products targeting artificial intelligence (AI) and high-performance computing (HPC) applications, the B100 will use TSMC's 3nm process and a more complex multi-chip module (MCM) design, and will appear in the fourth quarter of 2024.
For NVIDIA, which monopolizes more than 80% of the artificial intelligence GPU market, it can use the B100 to strike while the iron is hot and take advantage of this wave of AI deployment. During the craze, it further attacked challengers such as AMD and Intel.
According to NVIDIA estimates, the field is expected to be worth approximately $300 billion by 2027
Unlike the Hopper/Ada architecture, the Blackwell architecture will extend to data centers and consumer GPUs. Rewritten content: Unlike the Hopper/Ada architecture, the Blackwell architecture will be extended to data centers and consumer-grade GPUs
It is reported that the B100 is not expected to have a significant change in the number of cores , but there are signs that its underlying architecture will undergo major adjustments.
This multi-chip module (MCM) design shows that Nvidia will use advanced packaging technology to separate GPU components into independent chips
Although the specific chip quantity and configuration have not yet been determined, this approach will give NVIDIA greater flexibility in the field of custom chips
This It is exactly the same as AMD’s intention to launch the Instinct MI300 series.
However, it remains to be seen which 3nm-level process Nvidia B100 will use.
Currently, TSMC already has many 3nm nodes, including performance-enhancing N3P and high-performance computing-oriented N3X
Given that Nvidia uses customized manufacturing technology on Ada Lovelace, Hopper and Ampere, it can be inferred that the new Blackwell will most likely use customized nodes.
Of course, not only NVIDIA will adopt TSMC N3 technology next year
AMD, Intel ), MediaTek and Qualcomm will all use one of TSMC’s 3nm nodes in 2024-2025.
In fact, MediaTek has adopted TSMC’s first N3E design.
Currently, only Apple uses TSMC’s N3B (first-generation N3) technology to manufacture its latest A17 Pro chip.
In addition, other chips, such as M3, M3 Pro, M3 Max and M3 Ultra, are also expected to use N3B technology.
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