


Planned for commercial use in 2025, reports say TSMC has formed a 200-person research team to advance silicon photonics technology
According to news from this site on October 5, according to TrendForce, TSMC is currently cooperating with major customers such as NVIDIA and Broadcom. It has established a silicon photonics technology team of more than 200 researchers, with the goal of launching a silicon photonics technology by the end of 2024. The project will be completed in half a year and will be put into commercial use in 2025.

It is reported that TSMC’s Compact Universal Photonic Engine (COUPE) provides photonic IC (PIC) and electronic IC (EIC) differences. Quality integration reduces energy consumption by 40%, which is expected to significantly increase customers' willingness to adopt.
PIDA CEO Luo Huaijia said that silicon photonics technology has always been an important focus in the field of optoelectronics, and optoelectronic products are developing in the direction of being thin, compact, energy-saving, and power-saving
Silicon Photonics And co-packaging optical components (CPO) has become a new technology in the industry. There are rumors on the Internet that TSMC is working with major customers such as Broadcom and Nvidia to jointly develop it, and large orders will begin as early as the second half of next year.
This site reported in September this year that TSMC is highly optimistic about silicon photonics technology. TSMC Vice President Yu Zhenhua recently publicly stated: “If we can provide a good silicon photonics integrated system, we can solve the problem of energy efficiency and AI computing capabilities. Two key issues. This will be a new paradigm shift. We may be at the beginning of a new era."
Luo Huaijia's analysis shows that GlobalFoundries may be the first company to provide crystals for manufacturing optical transceivers. Round foundry, they adopt FD-SOI technology integration solution. In addition, Intel currently has 400Gb/s optical transceiver solutions, which are not only suitable for its own ASICs or FPGAs, but also for Switch ICs. Intel even plans to expand silicon photonics solutions to the automotive market and use them in Mobileye's optical radar by 2025. Advertising statement: This article contains external jump links (including but not limited to hyperlinks, QR codes , password, etc.), it is designed to provide more information and save screening time. The results are for reference only. Please note that all articles on this site contain this statement
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According to news from this site on October 5, according to TrendForce, TSMC is currently cooperating with major customers such as NVIDIA and Broadcom to form a silicon photonics technology team with more than 200 researchers. It aims to complete the project in the second half of 2024 and It will be put into commercial use in 2025. According to reports, TSMC’s Compact Universal Photon Engine (COUPE) provides heterogeneous integration of photonic ICs (PICs) and electronic ICs (EICs), reducing energy consumption by 40% and is expected to significantly increase customers’ adoption willingness. PIDA CEO Luo Huaijia said that silicon photonics technology has always been an important focus in the optoelectronic field. Optoelectronic products are developing in the direction of being thin, compact, energy-saving, and power-saving. Silicon photonics and co-packaged optical components (CPO) have become new technologies in the industry. ,

MediaTek and TSMC are both Taiwanese companies, and TSMC is one of MediaTek's wafer suppliers; MediaTek is a world-renowned IC design manufacturer, focusing on wireless communications and digital multimedia and other technical fields; TSMC is a semiconductor manufacturing company founded in 1987. The world's first professional integrated circuit manufacturing service company, its headquarters and main factory are located in Hsinchu Science Park, Taiwan.

TSMC's full name is "Taiwan Semiconductor Manufacturing Co., Ltd." It is a semiconductor manufacturing company. Founded in 1987, it is the world's first professional integrated circuit manufacturing service (wafer foundry) company; the company operates an integrated Circuit manufacturing, the chips produced for customers cover many electronic product application fields such as computer products, communication products, consumer, industrial and standard semiconductors.

News from this site on November 13, according to Taiwan Economic Daily, TSMC’s CoWoS advanced packaging demand is about to explode. In addition to NVIDIA, which has confirmed expanded orders in October, heavyweight customers such as Apple, AMD, Broadcom, and Marvell have also recently pursued orders significantly. According to reports, TSMC is working hard to accelerate the expansion of CoWoS advanced packaging production capacity to meet the needs of the above-mentioned five major customers. Next year's monthly production capacity is expected to increase by about 20% from the original target to 35,000 pieces. Analysts said that TSMC's five major customers have placed large orders, which shows that artificial intelligence applications have become widely popular, and major manufacturers are interested in artificial intelligence chips. The demand has increased significantly. Inquiries on this site found that the current CoWoS advanced packaging technology is mainly divided into three types - CoWos-S

According to news from this website on April 10, according to the Liberty Times, TSMC plans to send Dr. Zhuang Zishou to the United States in May this year to cooperate with Wang Yinglang to jointly promote the construction of TSMC’s US factory. The U.S. Department of Commerce has currently finalized the amount of subsidies for TSMC, Intel, and Samsung, but TSMC's factories in the United States still have many problems. TSMC’s leadership hopes to promote the implementation of advanced processes as soon as possible by sending Dr. Zhuang Zishou to work with Wang Yinglang, who specializes in production and manufacturing. Check out the official TSMC leadership team on this site: Dr. Zhuang Zishou is currently the deputy general manager of factory affairs at TSMC, responsible for the planning, design, construction and maintenance of new factories, as well as the operation and upgrade of existing factory facilities. Dr. Zhuang joined TSMC in 1989 as a

According to news from this site on April 17, TrendForce recently released a report, believing that demand for Nvidia's new Blackwell platform products is bullish, and is expected to drive TSMC's total CoWoS packaging production capacity to increase by more than 150% in 2024. NVIDIA Blackwell's new platform products include B-series GPUs and GB200 accelerator cards integrating NVIDIA's own GraceArm CPU. TrendForce confirms that the supply chain is currently very optimistic about GB200. It is estimated that shipments in 2025 are expected to exceed one million units, accounting for 40-50% of Nvidia's high-end GPUs. Nvidia plans to deliver products such as GB200 and B100 in the second half of the year, but upstream wafer packaging must further adopt more complex products.

According to the news of this website on July 29, according to the Taiwan media "United News Network", due to the impact of Typhoon "Gemei", the 2nm wafer manufacturing factory under construction in Kaohsiung, Taiwan, was temporarily suspended on July 24. The factory has now resumed construction. . ▲Image source Taiwanese media learned after inquiries that Typhoon "Geme" caused widespread flooding in the Kaohsiung area of Taiwan. Nearly 500,000 households lost power, three people died and hundreds of people were injured. However, TSMC stated that the storm did not have a serious impact on its 2nm factory. The Zhuke Baoshan factory in Hsinchu has resumed trial production first. Regarding the Nanzi Industrial Park factory in Kaohsiung, TSMC stated that Typhoon Gemei only caused the collapse of the factory fence. At present, the relevant facilities have been restored. The drainage system and flood detention pond in the factory area were fully functional during the typhoon.

According to news from this website on November 25, financial analyst Dan Nystedt recently pointed out that based on the financial report data of various companies in the third quarter of 2023, Nvidia surpassed TSMC and Intel and took the top spot in the chip industry revenue. Nvidia’s revenue in the third fiscal quarter was US$18.120 billion (note on this site: currently about 129.377 billion yuan), an increase of 206% compared with US$5.931 billion in the same period last year, and an increase compared with US$13.507 billion in the previous fiscal quarter. 34%. NVIDIA's net profit in the third fiscal quarter was US$9.243 billion (currently approximately 65.995 billion yuan), an increase of 1259% compared with US$680 million in the same period last year, and an increase of 49% compared with US$6.188 billion in the previous fiscal quarter.
