TSMC is accelerating its move towards 2nm process, and it is reported that the Kaohsiung factory is planning to mass produce N2P

According to news from this site on October 12, TSMC is accelerating towards 2nm. According to MoneyDJ, the TSMC factory in Baoshan, Hsinchu is expected to start installing equipment in the second quarter of 2024, and mass production is expected to begin in the fourth quarter of 2025, with an initial monthly output of about 30,000 wafers.

TSMC’s Kaohsiung factory is currently actively “preparing” for war. It is expected that one year after the launch of the N2 process,

Adopt back power supply technology and mass produce N2P (2nm enhanced version) process.

This site previously reported that TSMC had previously revealed information that by expanding the backside power rail solution on the N2 process to reduce infrared attenuation and improve signals, performance can be improved by 10% to 12%. , and reduce the logic area by 10% to 15%.

TSMC plans to deliver backside power rail samples to customers in the second half of 2025, and plans to start mass production in 2026

Samsung’s previously announced semiconductor plan is to mass-produce 2nm in 2025. 1.4nm will be mass-produced in 2027; Intel is expected to mass-produce 20A using Gate All Around (GAA) technology RibbonFET transistor architecture in the first half of 2024, and 18A in 2025.

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