Loongson Zhongke's first domestic chip packaging base project goes into production in Hebi

WBOY
Release: 2023-10-13 15:45:08
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News from this site on October 13, according to Hebi Daily, on the afternoon of October 12, the commissioning ceremony of the Loongson Zhongke chip packaging base project was held in Hebi Science and Technology Innovation City. Loongson Zhongke's chip packaging base is located in Baijia Intelligent Manufacturing Industrial Park in Hebi Science and Technology Innovation City. is Loongson Zhongke's first chip packaging project deployed nationwide.

Loongson Zhongkes first domestic chip packaging base project goes into production in Hebi

In April this year, the first phase of the project officially started construction. A thousand-level clean factory covering an area of ​​402 square meters and a clean factory covering an area of ​​226 square meters will be built. A 10,000-square-meter clean factory building and a 92-square-meter constant temperature and humidity warehouse

According to the person in charge of Loongson Zhongke Technology Co., Ltd., the project has initially developed the bonding and packaging capabilities of Loongson One No. 1 chip packaging, testing, packaging and shipping capabilities, and accelerate the construction of the Loongson No. 1 series of chips, as well as the packaging and testing capabilities of the power/clock chip series. The next step will be to gradually accumulate experience and reserve talents, and strive to build a national chip packaging system.

This site inquired about the official website of Loongson Zhongke and learned that

Loongson No. 1 is a product developed by Loongson Zhongke for embedded specialized applications. Currently, the official website lists three products:

  • Loongson 1C101: Loongson 1C101 is a microcontroller chip optimized for door lock applications based on Loongson 1C100

  • Loongson 1C102: A customized chip in the embedded field Products, mainly for smart homes and other IoT devices

  • Loongson 1C103 is a chip for motor-driven IoT products. It uses the Loongson LA132 processor as the computing core and is specially designed Microcontroller chips for motor drive applications

Loongson Zhongkes first domestic chip packaging base project goes into production in Hebi
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