Microsoft recently filed a patent application that could revolutionize the way devices are cooled. Titled "Device Cooling," the patent was filed on February 6, 2022 and was recently published.
This patent describes a unique method of cooling equipment, specifically air cooling. The innovation lies in the temperature-based gas separation component, which is designed to receive ambient air and separate it into warmer and cooler air.
Typically, heat-generating components such as CPUs and GPUs can be cooled by moving ambient air over them. However, this cooling process is much more efficient if cooler air is passed through the heating components.
This new patent from Microsoft proposes a solution in which the device can separate the air that can be used to cool heat-generating components into a warmer airflow and a cooler airflow. The cooler stream can be used to cool heat-generating components, while the warmer stream can be discarded.
Simply put, ambient air is divided into two parts: warm air and cool air. Warmer air is directed outside the device's enclosure, while cooler air is directed inside.
This innovative approach improves equipment performance by maintaining optimal operating temperatures.
Thermal management is a critical aspect of device performance. Overheating can lead to reduced efficiency, component damage and, in extreme cases, equipment failure. By using this new method to effectively manage heat generation, Microsoft's patent could significantly increase device lifespan and reliability.
This patent represents another step forward in Microsoft’s efforts to continuously innovate and improve user experience. As we continue to demand higher performance from our devices, innovations like this will be key to ensuring our technology can keep pace.
The above is the detailed content of Microsoft's latest innovation: a device cooling technology that effectively separates cold and hot air. For more information, please follow other related articles on the PHP Chinese website!