News on October 23, TSMC recently revealed that inventory adjustments in areas such as PCs and mobile phones are showing signs of improvement. At the same time, MediaTek’s new 5G flagship chip, Dimensity 9400, plans to enter mass production in February next year, one to two months ahead of schedule. The chip will be used by OPPO, vivo, Xiaomi, etc. Used by major manufacturers.
The report points out that MediaTek is the first to usher in a recovery in the smartphone market, and it is expected that next year’s shipment performance will be significantly better than this year. MediaTek will hold a press conference this Friday and is currently in a confidentiality period before the conference. Foreign-funded institutions are confident in MediaTek's future potential and have even set a target stock price of up to 1,000 yuan.
According to the editor’s understanding, supply chain sources say that although Dimensity 9400 is planned to be released in the second half of next year, it will enter the mass production stage as early as February next year, one to two months earlier than previous plans.
According to previous reports, MediaTek and TSMC announced in September this year that the first Dimensity flagship chip using TSMC’s 3nm process will be launched in the second half of next year. It has already completed tape-out and has been named For Dimensity 9400.
TSMC pointed out that compared to the 5-nanometer process, its 3-nanometer process technology has higher logic density, about 60% increase, and 18% increase in speed under the same power consumption, or 18% increase in power consumption at the same speed. Reduced by 32%. The introduction of this technology will bring better performance and efficiency to the smartphone market.
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