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Huacan Optoelectronics' Chinese name was changed to 'BOE Huacan Optoelectronics' and 23.08% of its shares were sold last year
Huacan Optoelectronics' Chinese name was changed to 'BOE Huacan Optoelectronics' and 23.08% of its shares were sold last year
BOE Huacan Optoelectronics Co., Ltd. announced on October 30 that it will change its Chinese name to "BOE Huacan Optoelectronics Co., Ltd." and its English name will also be changed from "HC SemiTek Corporation" to "BOE HC SemiTek Corporation" , the securities abbreviation and code will remain unchanged
This site noticed that this name change originated from Huacan Optoelectronics on November 4, 2022 In the share subscription agreement signed with BOE, BOE plans to use 2083597236 yuan in cash to subscribe for 372070935 shares issued by Huacan Optoelectronics to specific objects this time. After the subscription is completed, BOE will become the largest shareholder with a shareholding ratio of 23.08%.
BOE stated that the acquisition of Huacan Optoelectronics canquickly complete the layout of key links in LED chips, and complement the existing business to form a complete business system, from technology, products, production capacity, market , talents and other aspects to enhance business competitiveness.
It is worth mentioning that Huacan Optoelectronics’ Micro LED wafer manufacturing and packaging testing base project officially started on July 31. The total investment in the project is 5 billion yuan. After full production, the annual output value can reach 5 billion yuan. .The total investment of the first phase of the project is over 2 billion yuan, and it is planned to be put into production in the third quarter of 2024.
The products of this project are Micro LED wafers and pixel devices. After completion, the annual output of Micro LED wafers will be 5.88 The production capacity of 10,000 chip sets and 45,000.00kk Micro LED pixel devices is mainly aimed at ultra-large and ultra-small size high-definition display scenarios, for large-size commercial displays, AR / VR head-mounted display devices and wearable devices, etc. Application areas.
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