Technology peripherals
It Industry
It is reported that Pioneer International Semiconductor acquires AUO's Singapore factory to build an advanced 12-inch automotive chip wafer fab
It is reported that Pioneer International Semiconductor acquires AUO's Singapore factory to build an advanced 12-inch automotive chip wafer fab
News from this site on October 31, according to the Economic Daily, we learned from industry insiders that Pioneer International Semiconductor/World Advanced (VIS) is currently negotiating with AUO's Singapore factory, to acquire the latter's holdings of land and equipment to build the first 12-inch wafer fab.
Pioneer International Semiconductor plans to invest US$2 billion (approximately RMB 14.64 billion yuan) to produce chips, mainly used in the automotive field
According to reports, Pioneer International Semiconductor will hold a relevant meeting on November 7. AUO plans to hold a relevant meeting on October 31. The two companies have not yet issued official comments on the relevant rumors
The report states that AUO plans to gradually withdraw its development focus in Singapore from manufacturing to establishing regional services. center.
This Singapore factory was purchased by AUO in 2010. It specializes in the production of 4.5th generation low-temperature polysilicon (LTPS) display panels and has certain AMOLED display production capacity. The location of the factory is very convenient, only an eight-minute drive from TSMC's factory in Singapore (SSMC). The transaction value is expected to exceed one billion US dollars.
This site reported in January last year that Pioneer International Semiconductor acquired AUO's L3B factory buildings and facilities.
AUO's L3B factory in Zhuke is an 8-inch wafer factory purchased in 1999, with a construction area of approximately 48,400 square meters (approximately 14,600 square meters). The estimated value of the factory is approximately NT$789 million, while the value of the ancillary equipment is NT$113 million.
Related reading:
"World Advanced Officially Takes Over AUO's L3B 8-inch Crystal Round Factory》
Advertising statement: The external jump links (including but not limited to hyperlinks, QR codes, passwords, etc.) contained in the article are used to transmit more information and save selection time. The results are only For reference, all articles on this site contain this statement.
The above is the detailed content of It is reported that Pioneer International Semiconductor acquires AUO's Singapore factory to build an advanced 12-inch automotive chip wafer fab. For more information, please follow other related articles on the PHP Chinese website!
Hot AI Tools
Undresser.AI Undress
AI-powered app for creating realistic nude photos
AI Clothes Remover
Online AI tool for removing clothes from photos.
Undress AI Tool
Undress images for free
Clothoff.io
AI clothes remover
AI Hentai Generator
Generate AI Hentai for free.
Hot Article
Hot Tools
Notepad++7.3.1
Easy-to-use and free code editor
SublimeText3 Chinese version
Chinese version, very easy to use
Zend Studio 13.0.1
Powerful PHP integrated development environment
Dreamweaver CS6
Visual web development tools
SublimeText3 Mac version
God-level code editing software (SublimeText3)
Hot Topics
1378
52
Innolux plans to mass-produce fan-out panel-level semiconductor packaging technology by the end of the year
Aug 07, 2024 pm 06:18 PM
According to news from this site on August 6, Yang Zhuxiang, general manager of Innolux Corporation, said yesterday (August 5) that the company is actively deploying and promoting semiconductor fan-out panel-level packaging (FOPLP) and is expected to mass-produce ChipFirst before the end of this year. The contribution of process technology to revenue will be apparent in the first quarter of next year. Fenye Innolux stated that it is expected to mass-produce the redistribution layer (RDLFirst) process technology for mid-to-high-end products in the next 1-2 years, and will work with partners to develop the most technically difficult glass drilling (TGV) process, which will take another 2-3 years. It can be put into mass production within a year. Yang Zhuxiang said that Innolux’s FOPLP technology is “ready for mass production” and will enter the market with low-end and mid-range products.
Is the 1nm chip made in China or the United States?
Nov 06, 2023 pm 01:30 PM
It is not certain who made the 1nm chip. From a research and development perspective, the 1nm chip was jointly developed by Taiwan, China and the United States. From a mass production perspective, this technology is not yet fully realized. The main person in charge of this research is Dr. Zhu Jiadi of MIT, who is a Chinese scientist. Dr. Zhu Jiadi said that the research is still in its early stages and is still a long way from mass production.
First in China: Changxin Memory launches LPDDR5 DRAM memory chip
Nov 28, 2023 pm 09:29 PM
News from this site on November 28. According to the official website of Changxin Memory, Changxin Memory has launched the latest LPDDR5DRAM memory chip. It is the first domestic brand to launch independently developed and produced LPDDR5 products, achieving a breakthrough in the domestic market and also making Changxin Storage's product layout in the mobile terminal market is more diversified. This website noticed that Changxin Memory LPDDR5 series products include 12Gb LPDDR5 particles, POP packaged 12GBLPDDR5 chips and DSC packaged 6GBLPDDR5 chips. The 12GBLPDDR5 chip has been verified on models of mainstream domestic mobile phone manufacturers such as Xiaomi and Transsion. LPDDR5 is a product launched by Changxin Storage for the mid-to-high-end mobile device market.
It is reported that TSMC's advanced packaging customers are chasing orders significantly, and monthly production capacity is planned to increase by 120% next year
Nov 13, 2023 pm 12:29 PM
News from this site on November 13, according to Taiwan Economic Daily, TSMC’s CoWoS advanced packaging demand is about to explode. In addition to NVIDIA, which has confirmed expanded orders in October, heavyweight customers such as Apple, AMD, Broadcom, and Marvell have also recently pursued orders significantly. According to reports, TSMC is working hard to accelerate the expansion of CoWoS advanced packaging production capacity to meet the needs of the above-mentioned five major customers. Next year's monthly production capacity is expected to increase by about 20% from the original target to 35,000 pieces. Analysts said that TSMC's five major customers have placed large orders, which shows that artificial intelligence applications have become widely popular, and major manufacturers are interested in artificial intelligence chips. The demand has increased significantly. Inquiries on this site found that the current CoWoS advanced packaging technology is mainly divided into three types - CoWos-S
TrendForce: Nvidia's Blackwell platform products drive TSMC's CoWoS production capacity to increase by 150% this year
Apr 17, 2024 pm 08:00 PM
According to news from this site on April 17, TrendForce recently released a report, believing that demand for Nvidia's new Blackwell platform products is bullish, and is expected to drive TSMC's total CoWoS packaging production capacity to increase by more than 150% in 2024. NVIDIA Blackwell's new platform products include B-series GPUs and GB200 accelerator cards integrating NVIDIA's own GraceArm CPU. TrendForce confirms that the supply chain is currently very optimistic about GB200. It is estimated that shipments in 2025 are expected to exceed one million units, accounting for 40-50% of Nvidia's high-end GPUs. Nvidia plans to deliver products such as GB200 and B100 in the second half of the year, but upstream wafer packaging must further adopt more complex products.
SK hynix's innovative semiconductor CMP polishing pad technology enables sustainable use
Dec 28, 2023 pm 11:04 PM
According to news from this website on December 27, according to Korean media ETNews, SK Hynix has recently developed reusable CMP polishing pad technology, which can not only reduce costs, but also enhance ESG (environmental, social, governance) management. SK Hynix said that they will first deploy reusable CMP polishing pads in low-risk processes and gradually expand their application scope. Note: CMP technology is to make the surface of the material to be polished under the combined action of chemicals and mechanics. A process to achieve the required flatness. The chemical components in the polishing fluid react chemically with the material surface to form a softened layer that is easy to polish. The polishing pad and abrasive particles in the polishing fluid physically and mechanically polish the material surface to remove the softened layer. Source: Dinglong shares in CM
Sources say NVIDIA is developing China-specific versions of AI chips HGX H20, L20 PCle and L2 PCle
Nov 09, 2023 pm 03:33 PM
The latest news shows that according to reports from the Science and Technology Innovation Board Daily and Blue Whale Finance, industry chain sources revealed that NVIDIA has developed the latest version of AI chips suitable for the Chinese market, including HGXH20, L20PCle and L2PCle. As of now, NVIDIA has not commented. People familiar with the matter said that these three chips are all based on improvements from NVIDIA H100. NVIDIA is expected to announce them as soon as November 16, and domestic manufacturers will get samples as soon as these days. After checking public information, we learned that NVIDIAH100TensorCoreGPU adopts the new Hopper architecture, which is based on TSMC N4 process and integrates 80 billion transistors. Compared with the previous generation product, it can provide multi-expert (MoE)
AUO showcases new Micro LED products: 17.3-inch folding screen debuts, and 31-inch single-chip large screen
Jun 05, 2024 pm 02:53 PM
According to news from this site on May 17, AUO showcased a series of new display products based on MicroLED technology at the SID Display Week 2024 held this week. AUO's 17.3-inch MicroLED folding display made its debut at the exhibition. The display's color gamut covers 100% AdobeRGB, its brightness reaches 1,000 nits, and its hinge radius is only 4mm. It is easy to carry in folding mode and can meet the creative needs of professional creatives anytime and anywhere. AUO has brought the world's largest single-chip MicroOLED display this time. This 31-inch single-chip large screen is equipped with AUO's A.R.T. anti-reflective and advanced driver display technology and supports indoor and outdoor use. In terms of automotive applications, AUO demonstrated a 163ppi
