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It is reported that TSMC's advanced packaging customers are chasing orders significantly, and monthly production capacity is planned to increase by 120% next year
It is reported that TSMC's advanced packaging customers are chasing orders significantly, and monthly production capacity is planned to increase by 120% next year
News from this site on November 13, according to Taiwan Economic Daily, TSMC’s CoWoS advanced packaging demand is about to explode. In addition to NVIDIA, which has confirmed to expand orders in October, heavyweight customers such as Apple, AMD, Broadcom, and Marvell have also recently increased their orders. Chase orders.
According to reports, TSMC is working hard to accelerate the expansion of CoWoS advanced packaging production capacity to meet the needs of the above-mentioned five major customers. Next year's monthly production capacity is expected to increase by about 20% from the original target to 35,000 pieces
Analysts said that TSMC's five major customers Large orders have been placed one after another, which shows that artificial intelligence applications have become widely popular, and the demand for artificial intelligence chips from major manufacturers has increased significantly
Inquiries on this site found that the current CoWoS advanced packaging technology is mainly divided into three types - CoWos- S, CoWoS-R, CoWoS-L, among which CoWoS-L is one of the latest technologies. CoWoS-L combines the advantages of CoWoS-S and InFO technologies, using interposers and LSI (local silicon interconnect) chips to provide a flexible integration solution that can be applied to chip-to-chip integration
According to public information, Nvidia is currently one of the major customers of TSMC’s CoWoS advanced packaging, occupying almost 60% of the relevant production capacity. Their H100, A100 and other artificial intelligence chips all use this packaging technology. In addition, AMD's latest artificial intelligence chip products have also entered the mass production stage. It is expected to release the MI300 chip next year. The chip will adopt two advanced packaging structures such as SoIC and CoWoS
In addition, AMD's Xilinx has also been a major customer of TSMC's CoWoS advanced packaging. As the demand for AI continues to increase in the future, companies such as Xilinx and Broadcom have also begun to add CoWoS advanced packaging capacity to TSMC.
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It is reported that TSMC's advanced packaging customers are chasing orders significantly, and monthly production capacity is planned to increase by 120% next year
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News from this site on November 13, according to Taiwan Economic Daily, TSMC’s CoWoS advanced packaging demand is about to explode. In addition to NVIDIA, which has confirmed expanded orders in October, heavyweight customers such as Apple, AMD, Broadcom, and Marvell have also recently pursued orders significantly. According to reports, TSMC is working hard to accelerate the expansion of CoWoS advanced packaging production capacity to meet the needs of the above-mentioned five major customers. Next year's monthly production capacity is expected to increase by about 20% from the original target to 35,000 pieces. Analysts said that TSMC's five major customers have placed large orders, which shows that artificial intelligence applications have become widely popular, and major manufacturers are interested in artificial intelligence chips. The demand has increased significantly. Inquiries on this site found that the current CoWoS advanced packaging technology is mainly divided into three types - CoWos-S
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