According to news on November 13, Realme’s official Weibo announced that the GT5 Pro, which will be launched this month, will become the brand’s dual-engine flagship, ushering in a new generation of smartphones.
It is understood that the first batch of Realme GT5 Pro will be equipped with one of the most powerful mobile platforms in the industry, Qualcomm Snapdragon 8 Gen3. This chip uses TSMC's 4nm process and adopts a 152 core architecture design. These include a powerful X4 3.3GHz super core, three A720 3.15GHz cores, two A720 2.96GHz and two A520 2.27GHz cores. At the same time, the mobile platform is also equipped with Adreno 750 GPU, supports the light tracing technology of Unreal Engine 5 and WiFi 7, and integrates the Snapdragon X75 baseband to provide users with an excellent user experience
In order to give full play to Snapdragon 8 Gen3’s powerful performance, Realme GT5 Pro has undergone a large-scale heat dissipation upgrade. According to the digital blogger Chat Station, the machine not only breaks the record again in terms of heat dissipation area, but also uses precision stacking technology inside the fuselage to achieve villa-level three-dimensional heat dissipation, challenging the limits of the industry
According to the editor’s understanding, GT5 The Pro screen adopts a 1.5K curved surface design to present users with a more shocking visual effect. The phone has a three-camera configuration on the rear, each with 50 million, 50 million, and 8 million pixels, providing users with more room for creative photography. The battery capacity reaches 5400mAh and supports 100W wired flash charging and 50W wireless flash charging, which greatly shortens the charging waiting time and improves user convenience.
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