Technology peripherals
It Industry
Japan plans to invest 2 trillion yen to support the chip and AI industries, and TSMC may benefit from the aid plan
Japan plans to invest 2 trillion yen to support the chip and AI industries, and TSMC may benefit from the aid plan
News from this site on November 14, according to Nikkei News, the Japanese government is seeking 2 trillion yen (this site’s note: currently about 96.2 billion yuan) in budget funds to support chip production and generative artificial intelligence technology, including increasing aid to TSMC.
Japan’s Ministry of Economy, Trade and Industry (METI) seeks about 650 billion yen in a budget supplement (approximately 31.265 billion yuan) of funds to support the construction of Japanese semiconductor company Rapidus’s prototype production line and Intel research center, as well as promote advanced semiconductor design
According to reports, approximately 770 billion yen (approximately 31.265 billion yuan) 37.037 billion yuan) aid will be used for TSMC’s second factory in Kumamoto. In addition, TSMC has already received subsidies covering half of the construction costs of its first factory
In addition, approximately 460 billion yen (currently approximately 22.126 billion yuan) will be added to the proposed budget , to support the construction of Power Semiconductor's new factory in Miyagi Prefecture in the northeast. The money will also be used to aid power semiconductors, a key component of electric vehicles.
In order to encourage domestic enterprises to develop generative AI technology, Japan also plans to provide approximately 190 billion yen (approximately 9.139 billion yuan) in funds for the development of supercomputers to process data for AI learning models and other fields.
METI’s spending proposal has been cut from the 3.4 trillion yen originally sought related to semiconductors, but is still higher than the 1.3 trillion yen provided in the main fiscal year 2022 budget. The ministry's overall supplementary budget proposal is 4.9 trillion yen.
The rewritten content is as follows: This includes 800 billion yen for extending subsidies for electricity, household gas and gasoline, and 75 billion yen for the 2025 Osaka Expo; approximately 8.9 billion yen will be used In response to the international reaction caused by the discharge of wastewater from the Fukushima Daiichi Nuclear Power Plant and the harmed fisheries
Advertising statement: This article contains external jump links (including but not limited to hyperlinks, QR codes, passwords, etc. form), used to provide more information and save screening time, the results are for reference only. Please note that all articles on this site contain this statement
The above is the detailed content of Japan plans to invest 2 trillion yen to support the chip and AI industries, and TSMC may benefit from the aid plan. For more information, please follow other related articles on the PHP Chinese website!
Hot AI Tools
Undresser.AI Undress
AI-powered app for creating realistic nude photos
AI Clothes Remover
Online AI tool for removing clothes from photos.
Undress AI Tool
Undress images for free
Clothoff.io
AI clothes remover
AI Hentai Generator
Generate AI Hentai for free.
Hot Article
Hot Tools
Notepad++7.3.1
Easy-to-use and free code editor
SublimeText3 Chinese version
Chinese version, very easy to use
Zend Studio 13.0.1
Powerful PHP integrated development environment
Dreamweaver CS6
Visual web development tools
SublimeText3 Mac version
God-level code editing software (SublimeText3)
Hot Topics
Remember the Japanese otaku who married Hatsune Miku? The two have actually been divorced for almost 4 years
Mar 17, 2024 am 09:37 AM
On March 31, 2020, Hatsune Miku officially "divorced" the Japanese otaku who once spent millions to marry her. It has been almost 4 years since then. In fact, when the two got married, many people were not optimistic about the couple. After all, it was very outrageous for a person living in the third dimension to marry a paper person from the second dimension. However, in the face of the criticism from netizens, the Japanese otaku Kondo Akihiko did not back down. In the end, he held a wedding with Hatsune Miku. Judging from the photos Kondo Akihiko posted from time to time after his marriage, his life with Hatsune Miku It was quite good, but unfortunately their marriage did not last too long. As the Gatebox copyright of the first-generation Hatsune model expired, Kondo Akihiko's wife Hatsune Miku also
Innolux plans to mass-produce fan-out panel-level semiconductor packaging technology by the end of the year
Aug 07, 2024 pm 06:18 PM
According to news from this site on August 6, Yang Zhuxiang, general manager of Innolux Corporation, said yesterday (August 5) that the company is actively deploying and promoting semiconductor fan-out panel-level packaging (FOPLP) and is expected to mass-produce ChipFirst before the end of this year. The contribution of process technology to revenue will be apparent in the first quarter of next year. Fenye Innolux stated that it is expected to mass-produce the redistribution layer (RDLFirst) process technology for mid-to-high-end products in the next 1-2 years, and will work with partners to develop the most technically difficult glass drilling (TGV) process, which will take another 2-3 years. It can be put into mass production within a year. Yang Zhuxiang said that Innolux’s FOPLP technology is “ready for mass production” and will enter the market with low-end and mid-range products.
Is the 1nm chip made in China or the United States?
Nov 06, 2023 pm 01:30 PM
It is not certain who made the 1nm chip. From a research and development perspective, the 1nm chip was jointly developed by Taiwan, China and the United States. From a mass production perspective, this technology is not yet fully realized. The main person in charge of this research is Dr. Zhu Jiadi of MIT, who is a Chinese scientist. Dr. Zhu Jiadi said that the research is still in its early stages and is still a long way from mass production.
First in China: Changxin Memory launches LPDDR5 DRAM memory chip
Nov 28, 2023 pm 09:29 PM
News from this site on November 28. According to the official website of Changxin Memory, Changxin Memory has launched the latest LPDDR5DRAM memory chip. It is the first domestic brand to launch independently developed and produced LPDDR5 products, achieving a breakthrough in the domestic market and also making Changxin Storage's product layout in the mobile terminal market is more diversified. This website noticed that Changxin Memory LPDDR5 series products include 12Gb LPDDR5 particles, POP packaged 12GBLPDDR5 chips and DSC packaged 6GBLPDDR5 chips. The 12GBLPDDR5 chip has been verified on models of mainstream domestic mobile phone manufacturers such as Xiaomi and Transsion. LPDDR5 is a product launched by Changxin Storage for the mid-to-high-end mobile device market.
It is reported that TSMC's advanced packaging customers are chasing orders significantly, and monthly production capacity is planned to increase by 120% next year
Nov 13, 2023 pm 12:29 PM
News from this site on November 13, according to Taiwan Economic Daily, TSMC’s CoWoS advanced packaging demand is about to explode. In addition to NVIDIA, which has confirmed expanded orders in October, heavyweight customers such as Apple, AMD, Broadcom, and Marvell have also recently pursued orders significantly. According to reports, TSMC is working hard to accelerate the expansion of CoWoS advanced packaging production capacity to meet the needs of the above-mentioned five major customers. Next year's monthly production capacity is expected to increase by about 20% from the original target to 35,000 pieces. Analysts said that TSMC's five major customers have placed large orders, which shows that artificial intelligence applications have become widely popular, and major manufacturers are interested in artificial intelligence chips. The demand has increased significantly. Inquiries on this site found that the current CoWoS advanced packaging technology is mainly divided into three types - CoWos-S
TrendForce: Nvidia's Blackwell platform products drive TSMC's CoWoS production capacity to increase by 150% this year
Apr 17, 2024 pm 08:00 PM
According to news from this site on April 17, TrendForce recently released a report, believing that demand for Nvidia's new Blackwell platform products is bullish, and is expected to drive TSMC's total CoWoS packaging production capacity to increase by more than 150% in 2024. NVIDIA Blackwell's new platform products include B-series GPUs and GB200 accelerator cards integrating NVIDIA's own GraceArm CPU. TrendForce confirms that the supply chain is currently very optimistic about GB200. It is estimated that shipments in 2025 are expected to exceed one million units, accounting for 40-50% of Nvidia's high-end GPUs. Nvidia plans to deliver products such as GB200 and B100 in the second half of the year, but upstream wafer packaging must further adopt more complex products.
SK hynix's innovative semiconductor CMP polishing pad technology enables sustainable use
Dec 28, 2023 pm 11:04 PM
According to news from this website on December 27, according to Korean media ETNews, SK Hynix has recently developed reusable CMP polishing pad technology, which can not only reduce costs, but also enhance ESG (environmental, social, governance) management. SK Hynix said that they will first deploy reusable CMP polishing pads in low-risk processes and gradually expand their application scope. Note: CMP technology is to make the surface of the material to be polished under the combined action of chemicals and mechanics. A process to achieve the required flatness. The chemical components in the polishing fluid react chemically with the material surface to form a softened layer that is easy to polish. The polishing pad and abrasive particles in the polishing fluid physically and mechanically polish the material surface to remove the softened layer. Source: Dinglong shares in CM
Sony Group: Its semiconductor factories concealed emissions of harmful substances
Jul 12, 2024 pm 02:09 PM
According to reports from this website on July 8, based on reports from Nikkei and Japan's "Jiji News Agency", on the 8th (today) local time, Sony Semiconductor Manufacturing Company, a semiconductor manufacturer under the Sony Group, announced that the company had discharged harmful chemicals outside the factory. , and no notification was made. The company said this was due to an input error and an imperfect confirmation system. In fiscal years 2021 and 2022, the camera image sensor factory located in Kikuyo Town, Kumamoto Prefecture, incorrectly reported its emissions of chemical substances as 0. The actual situation was that there were emissions of "waste without harmless treatment." The plant emits hydrogen fluoride, which is commonly used in semiconductor processing and cleaning. Note from this site: Hydrogen fluoride is harmful to the human body and can cause respiratory diseases and even life-threatening effects when inhaled. sony half
