U.S. government to fund advanced packaging industry with $3 billion, aims to become global leader by 2030

According to news from this site on November 21, in order to enhance the competitiveness of the United States in the field of chip packaging, the U.S. government announced on Monday that it will invest approximately US$3 billion (note on this site: currently approximately 21.51 billion yuan) to support the United States. Chip packaging industry, this is the first R&D investment project under the Chip and Science Act.

Source Pexels

The last step in integrated circuit production is chip packaging, whose main purpose is to wrap the exposed chip in protective materials and provide features such as connection pins, thermal dissipation, and power management. Package form and materials can be selected based on chip type and application requirements. The technical level and production capacity of chip packaging directly affect the quality and supply of chips

Currently, the United States only accounts for 3% of the world's production capacity in the field of chip packaging. By comparison, China accounts for 38% of the world’s chip packaging capacity. This means that chips made in the United States need to be shipped overseas for packaging. U.S. Undersecretary of Commerce Laurie Locascio said when announcing the investment plan: "Make chips in the United States and then Shipping them overseas for packaging will bring risks to the supply chain and national security, which is unacceptable to us.”

In order to change this situation, the US government decided to start from the "Chip and Of the US$11 billion in R&D funds in the Science Act, US$3 billion will be earmarked for the development of the US chip packaging industry. The funding will be administered by the U.S. Department of Commerce’s National Institute of Standards and Technology, which will build an advanced chip packaging pilot facility and provide funding for new workforce training programs and other projects When announcing the investment plan, O also said that the US government's goal is that by 2030, the United States will have multiple high-volume advanced packaging facilities and become the global leader in batch advanced packaging of the most complex chips. Locascio also said that the U.S. Commerce Department is expected to announce the first materials and substrate funding opportunities for its chip packaging program next year, and that future investments will focus on other packaging technologies and the broader design ecosystem.

Inspired by the US Chip Act, many foreign companies have planned to launch packaging projects in the United States. South Korean chipmaker SK Hynix is ​​reportedly planning to invest $15 billion in advanced packaging facilities in the United States. TSMC is also in talks with Arizona to potentially build an advanced packaging plant in the state.

Advertising statement: The external jump links (including but not limited to hyperlinks, QR codes, passwords, etc.) contained in the article are used to convey more information and save selection time. The results are for reference only. All articles on the site contain this statement.

The above is the detailed content of U.S. government to fund advanced packaging industry with $3 billion, aims to become global leader by 2030. For more information, please follow other related articles on the PHP Chinese website!