MediaTek (MTK) officially released the Dimensity 8300 mobile chip on November 21. This product is regarded as Dimensity’s sub-flagship platform. MTK executives have high hopes for it, saying that "Dimensity 8300 will continue the new legend of God U"
Dimensity 8300 is manufactured using the second-generation TSMC 4nm process, and its CPU uses the Armv9 4 4 architecture. The main frequency of the large-core A715 can reach 3.35GHz, while the maximum main frequency of the energy-efficient core A510 is 2.2GHz. Compared with the previous generation of Dimensity 8200, the peak CPU performance of Dimensity 8300 is increased by 20%, while power consumption is saved by 30%
In terms of GPU, Dimensity 8300 is equipped with 6-core Mali-G615 MC6. Its GPU peak performance is 60% higher than that of Dimensity 8200, and power consumption is saved by 55%. This substantial GPU enhancement makes the Dimensity 8300 perform well in terms of gaming performance. According to the "Genshin Impact" game test results announced by MTK, compared with the 2022 H1 flagship of a competitor (Qualcomm's second-generation Snapdragon 8), the Dimensity 8300 has better performance in landing speed, average transition acceleration, stability optimization (mean square error) and average The performance is even better in terms of frame rate and other aspects, with a lead between 11% and 38%
It is worth mentioning that Dimensity 8300 is also the first mobile SoC in its class to support generative AI. Its APU 780 supports up to 10 billion parameter AI large models, and the overall AI performance can reach 3.3 times that of the previous generation. So many.
Lu Weibing, President of Xiaomi China, said at the launch of Dimensity 8300 that Redmi K70E will launch the customized Dimensity 8300-Ultra. This SoC jointly defined by Xiaomi and MTK has an AnTuTu score of over 1.52 million, and its AI capabilities are comparable to Dimensity 9300. It will be "invincible in its performance" for some time to come. It is reported that the Redmi K70 series will be released at the end of this month, with Xiaomi ThePaper OS pre-installed at the factory. The K70 is expected to use the second-generation Snapdragon 8 chip, and the K70 Pro will be equipped with the third-generation Snapdragon 8.
Keke Comments: The performance of Dimensity 8300 and 9300 is very good, I hope the terminal equipment can also perform well in the market
The above is the detailed content of Redmi K70E will be released soon, equipped with Dimensity 8300 chip, GPU and AI performance will be greatly improved. For more information, please follow other related articles on the PHP Chinese website!