Intel and TSMC reach historic cooperation, Lunar Lake chip will move towards the 3nm era

News on November 22, according to the latest report from TrendForce, Intel has ordered TSMC to use the 3nm process to produce the upcoming Lunar Orders for Lake chips. The move marks the first time TSMC has become the exclusive manufacturer of Intel's mainstream notebook CPUs.

Regarding this cooperation, neither TSMC nor Intel has commented yet. According to previously exposed technical details, TSMC will be responsible for producing Lunar for Intel Lake's three key chips, including CPU, GPU and NPU, all use advanced 3nm technology.

In addition, it is reported that TSMC will also be responsible for the production of high-speed I/O (PCH) chips, using a 5-nanometer process, and plans to start mass production in the first half of next year.

Intel has made a major decision to outsource the production of mainstream platform CPUs to TSMC, breaking past practice. This move means that the two parties may develop a deeper cooperative relationship in the future

According to the editor’s understanding, Lunar Lake differs from the previous two generations of Intel laptop platforms by integrating the CPU, GPU and NPU into a system on a chip (SoC). During the packaging process, Intel's Foveros advanced process is used to combine the SoC with the high-speed I/O chip and package the DRAM on the same IC substrate. LPDDR5x and two advanced packaging chips demonstrate innovative integration technology.

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