According to news on November 23, the Redmi K70 series will be released this month. It is expected to be officially announced today and will be officially released next week.
The latest news leaks show that the Redmi K70 Pro model will bring a series of eye-catching upgrades, not only involving performance improvements, but also all-round improvements. It is reported that the mobile phone adopts domestic cutting-edge direct-screen technology and eliminates the plastic bracket, making the frame significantly narrower and the overall feel more outstanding
According to the editor’s understanding, Redmi K70 Pro will live up to expectations by supporting fingerprint recognition technology. Compared with the side fingerprints of previous generations, this upgrade will bring a higher-end user experience. In addition, the model will also adopt a metal middle frame design, which will achieve a huge improvement in texture. It will not only crush the plastic frame in appearance, but is also expected to bring better heat dissipation performance.
It is understood that the standard version of the Redmi K70 series will be equipped with Qualcomm Snapdragon 8 Gen2 processor, while the Pro version will be upgraded to Qualcomm Snapdragon 8 Gen3. Officials claim that this will be the challenger with the strongest performance on the same platform. Snapdragon 8 Gen3 adopts TSMC's 4nm process and has an eight-core architecture design of 1 5 2, including a powerful Cortex-X4 ultra-large core, which improves performance by 30% and energy efficiency by 20% compared with the previous generation. In addition, Redmi K70 Pro will also support IP68 dustproof and waterproof functions, as well as impressive 120W flash charging technology. This series of comprehensive upgrades makes the Redmi K70 Pro a highly anticipated flagship phone.
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