Sources say Samsung has purchased a large amount of 2.5D packaging equipment to prepare for Nvidia's next-generation 'Blackwell” products

According to TheElec, Samsung has placed an order with Japan’s Shinkawa Company to purchase 16 units of 2.5D packaging bonding equipment. Sources revealed that Samsung has received 7 of the devices and may request the remaining devices if needed

▲ Source: Samsung

He said that this is most likely to provide HBM3 memory and 2.5D packaging services for Nvidia’s next-generation AI chips. Samsung's HBM3, interposer and 2.5D packaging technology may be used in Nvidia GB100 chips

However, when it comes to the GPU itself, Nvidia did not choose Samsung as a foundry partner, but chose their Main partner TSMC. However, in terms of post-manufacturing technology, Nvidia chose to cooperate with TSMC, Samsung and Anjiko at the same time

Note from this site: The manufacturing process of semiconductor products can be roughly divided into wafer production, packaging and testing, among which wafer manufacturing Wafer manufacturing belongs to the front-end (Front End) process; packaging and testing belong to the back-end (Back End) process; and the wafer manufacturing process will also be subdivided into the front-end and the back-end. Usually the CMOS process belongs to the front-end, and the subsequent The metal wiring process belongs to the back end.

Sources said that wafers for GB100 are expected to start manufacturing at TSMC around the end of the year, but wafer manufacturing will take up to four months, and the packaging process will start around the second quarter of next year. So Samsung is preparing in advance.

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