With a monthly output of 5,000 wafers, it is reported that Intel will enter the NVIDIA AI accelerator card packaging industry chain next month

News from this site on January 31, according to the Economic Daily, Nvidia plans to attract Intel to join its supply chain in order to alleviate the tight supply of advanced packaging production capacity.

Reports indicate that Nvidia’s AI accelerator cards are in tight supply and demand, and due to insufficient TSMC’s CoWoS advanced packaging capacity, Nvidia is considering absorbing Intel to alleviate the current tight situation of AI accelerator cards.

#This site quoted the media report that Intel is expected to officially join the Nvidia supply chain in February this year, with a monthly production capacity of 5,000 wafers. .

Industry analysis shows that even if Intel joins NVIDIA's supply chain and provides it with advanced packaging production capacity, TSMC will still be NVIDIA's main advanced packaging supplier. Taking into account the expanded capacity of TSMC and other related assembly and test partners, it is estimated that it will provide approximately 90% of Nvidia's advanced packaging capacity.

Supply and revealed that TSMC is sprinting to expand its advanced packaging production capacity. The monthly production capacity in the first quarter of this year is expected to increase to nearly 50,000 pieces, an increase of 25% from the nearly 40,000 pieces estimated in December last year.

Intel’s estimated monthly production capacity is 5,000 wafers, which accounts for about 10% of TSMC’s. Intel has advanced packaging production capabilities in Oregon and New Mexico in the United States, and is actively expanding advanced packaging at its new factory in Penang. It is worth noting that Intel has previously stated that its openness allows customers to choose only its advanced packaging solutions, with the goal of giving customers more production flexibility.

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