Home Technology peripherals It Industry It can reduce the use of expensive EUV lithography. Merck of Germany says DSA self-assembly technology will be commercially available within ten years.

It can reduce the use of expensive EUV lithography. Merck of Germany says DSA self-assembly technology will be commercially available within ten years.

Feb 05, 2024 pm 02:40 PM
chip wafer euv Lithography dsa Merck, Germany

According to news from this website on February 5, Anand Nambier, senior vice president of Merck of Germany, said at a press conference recently that DSA self-assembly technology will be commercialized in the next ten years, can reduce expensive EUV patterning Times , becoming an important supplement to existing photolithography technology.

Note on this site: DSA stands for Directed self-assembly. It uses the surface characteristics of block copolymers to realize the automatic construction of periodic patterns. On this basis, it is induced to finally form the desired direction-controllable pattern. pattern. It is generally believed that DSA is not suitable for use as an independent patterning technology, but rather is combined with other patterning technologies (such as traditional photolithography) to produce high-precision semiconductors.

可减少昂贵 EUV 光刻使用,德国默克称 DSA 自组装技术十年内商用
▲ Anand Nambier at the press conference. Image source The Elec
Anand Nambiar said: "DSA technology is in its infancy, and we believe it will become a basic technology in EUV lithography production in the next decade. Due to the high cost of EUV technology, , customers want to reduce the number of steps using EUV. We are cooperating with major global semiconductor companies on DSA research." According to Korean media The Elec, companies that use EUV lithography such as Samsung Electronics and SK Hynix have participated in related Research
.

The main application of DSA in EUV is to compensate for the random error of EUV. Random errors account for 50% of the overall patterning error in EUV processes.

Commercial large-scale application of DSA also needs to solve some problems, such as reducing defects such as bubbles, bridges and clusters that occur during pattern generation. Among them, bridge defects are one of the most common problems.

可减少昂贵 EUV 光刻使用,德国默克称 DSA 自组装技术十年内商用▲ The occurrence of DSA technical defects. Image source imec
According to data released by analyst firm TechInsights in January last year, Samsung holds 68 DSA-related patents, while TSMC and ASML hold 24 and 16 respectively.

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