It is reported that Xiaomi MIX Flip mobile phone has a dual-hole digging module on the rear and is equipped with Snapdragon 8 Gen 3

According to news on February 16th, blogger @ Smart Pikachu today brought the latest news about Xiaomi’s vertical small folding device, which is expected to be named Xiaomi MIX Flip.

The blogger broke the news that Xiaomi MIX Flip has a similar style to Huawei, both are minimalist style, with a dual rear hole-punch module, a 3x vertical telephoto lens, and special software for the secondary screen Defined module, equipped with Snapdragon 8 Gen 3 processor, macro was also tested. Another blogger @digitalchatstation previously revealed that Xiaomi’s vertically foldable mobile phone uses a domestically produced screen with “zero-perception creases”. The dual-camera small module and secondary screen design are relatively simple, using a 50M large screen. The bottom main camera is upright and telephoto. Xiaomi’s large folding model is equipped with the flagship 50M Periscope Quad Camera. Both new models support Snapdragon 8 Gen 3 processor and satellite communication functions. They adopt an “extremely thin and light” design, and the screen The fast charging peripherals are not neutered, and at the same time, it sheds tens of grams on the basis of the previous generation. Currently, Samsung, Huawei, OPPO, and vivo have all adopted the dual-line parallel strategy of "big folding and small folding", while Xiaomi and Honor have only launched "big folding" mobile phones. The launch of Xiaomi MIX Flip will also provide users with more choices. Currently, Xiaomi has not revealed the release time of this new phone, and will continue to pay attention and bring follow-up reports.

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