


With a compound growth rate of 3.3%, institutions estimate that the global power semiconductor market will reach US$55 billion in 2030
News from this site on March 6, according to the latest report released by the market research organization Straits Research, the global power semiconductor market revenue in 2020 was US$40 billion, It is estimated that the market will reach US$55 billion by 2030,The compound annual growth rate during the forecast period is 3.3%.

The widespread application of global consumer electronics products has promoted the expansion of the market size. Many consumer products rely on semiconductor technology, such as communication devices (smartphones, tablets, smart watches, etc.), computers (including printed circuit boards in personal and business computers), entertainment systems, and home appliances. As people's demand for smart devices and digital products continues to increase, the sales volume of consumer electronics products is also growing year by year. As one of the key technologies supporting these products, the semiconductor industry has developed rapidly and been widely used. With the continuous advancement and innovation of science and technology, the functions and performance of consumer electronic products are also constantly improving, promoting further expansion of the market. Power semiconductor is a component specially used to handle high current or high power. , usually refers to semiconductor products with a rated current of more than 1 amp. Although there is no clear standard division, generally speaking, such products are classified as power semiconductors. These devices play key roles in a variety of power electronics applications, including converters, inverters, and power amplifiers. Power semiconductors usually have high withstand voltage and current characteristics, which can effectively control the flow of electric energy and achieve efficient
Smartphones are one of the major consumers of the semiconductor industry. In the past few years, smartphones have intense market competition. It is expected that the use of smartphones will continue to increase in the future, driving the development of the global industry. According to Ericsson's forecast, the average monthly data traffic of global smartphone devices will increase from 32 exabytes in 2019 to 221 exabytes by 2026. This trend shows the importance of smartphones in the digital age and highlights people's growing demand for mobile communications and data transmission. As technology continues to advance, smartphones will continue to become an indispensable tool in people's lives, driving the global communications industry forward.
The main contents of the report attached to this site are as follows:
- The global power semiconductor market can be divided into discrete devices, modules and power integrated circuits based on different components. The power integrated circuit market is expected to hold the highest share and will continue to grow at a CAGR of 1.9% over the forecast period.
- The global power semiconductor market is divided into three categories based on different materials: silicon/germanium, silicon carbide (SiC) and gallium nitride (GaN). Among them, silicon/germanium has the largest market share and is expected to continue to grow at a compound annual growth rate of 1% during the future forecast period.
- By end-user industry, the global power semiconductor market can be divided into automotive, consumer electronics, IT and telecommunications, military and aerospace, power, industrial and other industries. Consumer electronics accounts for the largest market share and is expected to grow at a CAGR of 2% during the forecast period.
- Based on region, the global power semiconductor market can be divided into North America, Europe, Asia Pacific, Latin America, and the Middle East and Africa. Asia Pacific is expected to hold the largest market share and grow at a CAGR of 3.6% annually over the next few years.
- The original address of the report is attached to this website, and interested users can read it in depth.
The above is the detailed content of With a compound growth rate of 3.3%, institutions estimate that the global power semiconductor market will reach US$55 billion in 2030. For more information, please follow other related articles on the PHP Chinese website!

Hot AI Tools

Undresser.AI Undress
AI-powered app for creating realistic nude photos

AI Clothes Remover
Online AI tool for removing clothes from photos.

Undress AI Tool
Undress images for free

Clothoff.io
AI clothes remover

AI Hentai Generator
Generate AI Hentai for free.

Hot Article

Hot Tools

Notepad++7.3.1
Easy-to-use and free code editor

SublimeText3 Chinese version
Chinese version, very easy to use

Zend Studio 13.0.1
Powerful PHP integrated development environment

Dreamweaver CS6
Visual web development tools

SublimeText3 Mac version
God-level code editing software (SublimeText3)

Hot Topics



According to news from this site on August 6, Yang Zhuxiang, general manager of Innolux Corporation, said yesterday (August 5) that the company is actively deploying and promoting semiconductor fan-out panel-level packaging (FOPLP) and is expected to mass-produce ChipFirst before the end of this year. The contribution of process technology to revenue will be apparent in the first quarter of next year. Fenye Innolux stated that it is expected to mass-produce the redistribution layer (RDLFirst) process technology for mid-to-high-end products in the next 1-2 years, and will work with partners to develop the most technically difficult glass drilling (TGV) process, which will take another 2-3 years. It can be put into mass production within a year. Yang Zhuxiang said that Innolux’s FOPLP technology is “ready for mass production” and will enter the market with low-end and mid-range products.

According to news from this site on April 17, TrendForce recently released a report, believing that demand for Nvidia's new Blackwell platform products is bullish, and is expected to drive TSMC's total CoWoS packaging production capacity to increase by more than 150% in 2024. NVIDIA Blackwell's new platform products include B-series GPUs and GB200 accelerator cards integrating NVIDIA's own GraceArm CPU. TrendForce confirms that the supply chain is currently very optimistic about GB200. It is estimated that shipments in 2025 are expected to exceed one million units, accounting for 40-50% of Nvidia's high-end GPUs. Nvidia plans to deliver products such as GB200 and B100 in the second half of the year, but upstream wafer packaging must further adopt more complex products.

According to news from this website on December 27, according to Korean media ETNews, SK Hynix has recently developed reusable CMP polishing pad technology, which can not only reduce costs, but also enhance ESG (environmental, social, governance) management. SK Hynix said that they will first deploy reusable CMP polishing pads in low-risk processes and gradually expand their application scope. Note: CMP technology is to make the surface of the material to be polished under the combined action of chemicals and mechanics. A process to achieve the required flatness. The chemical components in the polishing fluid react chemically with the material surface to form a softened layer that is easy to polish. The polishing pad and abrasive particles in the polishing fluid physically and mechanically polish the material surface to remove the softened layer. Source: Dinglong shares in CM

The main difference is that semiconductor read-only memory ROM can store information permanently, while semiconductor random access memory RAM will lose information when the power is turned off. The characteristic of ROM is that it can only read information but cannot write information; and the content will not be lost after power is turned off, and it will automatically restore after powering on. The characteristic of RAM is its fast reading and writing speed. Its biggest disadvantage is that the contents inside it disappear immediately after the power is turned off.

According to reports from this website on July 8, based on reports from Nikkei and Japan's "Jiji News Agency", on the 8th (today) local time, Sony Semiconductor Manufacturing Company, a semiconductor manufacturer under the Sony Group, announced that the company had discharged harmful chemicals outside the factory. , and no notification was made. The company said this was due to an input error and an imperfect confirmation system. In fiscal years 2021 and 2022, the camera image sensor factory located in Kikuyo Town, Kumamoto Prefecture, incorrectly reported its emissions of chemical substances as 0. The actual situation was that there were emissions of "waste without harmless treatment." The plant emits hydrogen fluoride, which is commonly used in semiconductor processing and cleaning. Note from this site: Hydrogen fluoride is harmful to the human body and can cause respiratory diseases and even life-threatening effects when inhaled. sony half

Samsung plans to increase the import of more ASML extreme ultraviolet (EUV) lithography equipment, according to a report from South Korea's Electronic News Today. Although the confidentiality clause in the contract did not disclose specific details, according to securities market news, this agreement will allow ASML to A total of 50 sets of equipment will be provided within five years. The unit price of each equipment is approximately 200 billion won (approximately 1.102 billion yuan), and the total value can reach 10 trillion won (approximately 55.1 billion yuan). It is currently unclear what the contract The product is an existing EUV lithography equipment or a next-generation "HighNAEUV" lithography equipment. However, the biggest problem with current EUV lithography equipment is limited output. According to officials, it is "more complex than satellite components" and can only be produced in very limited quantities each year. according to

According to news from this site on October 31, the Economic Daily learned from industry insiders that Pioneer International Semiconductor/World Advanced (VIS) is currently negotiating with AUO's Singapore factory to acquire the land and equipment held by the latter and use it to Construction of the first 12-inch wafer fab. Source: AUO’s official website Pioneer International Semiconductor plans to invest US$2 billion (approximately RMB 14.64 billion) to produce chips, mainly for the automotive field. According to reports, Pioneer International Semiconductor will hold a relevant meeting on November 7. AUO plans to hold a relevant meeting on October 31. The two companies have not yet issued official comments on the relevant rumors. Reports indicate that AUO plans to gradually withdraw its development focus in Singapore from manufacturing to establishing a regional service center. This Singapore factory was established in 201

IT House reported on February 22 that Intel revealed the performance indicators of its future node evolution versions at the IFS DirectConnect event: each PPA increase does not exceed 10%. Note from IT Home: PPA stands for Power/Performance/Area, power consumption, performance, and area (logic density). The three as a whole are used as performance criteria for advanced processes. Intel has confirmed that it will launch evolutionary versions in the future and will use the "P", "T" and "E" suffixes to distinguish these versions, which respectively stand for "performance improvement", "through silicon via technology for 3D stacking" and "functional expansion" ". This move will provide users with more choices to meet different needs. ▲Intel Foundry: Process Roadmap Anandtech
