According to news from this site on March 14, TrendForce recently released a report stating that the mainstream specification of the HBM memory market in 2024 will be HBM3, but Nvidia’s upcoming B100 or H200 accelerator cards will use the HBM3e specification.
It is reported that in addition to the CoWoS packaging bottleneck of the current AI accelerator card, another important limitation is HBM. The main reason for this is that the production cycle of HBM is longer than that of DDR5. It takes at least 2 quarters to complete the chip production and packaging.
NVIDIA’s current mainstream H100 accelerator card uses HBM3 memory, and its main supplier is SK Hynix, which is currently unable to meet the overall AI market demand. TrendForce stated that Samsung will join Nvidia’s supply chain with 1Znm products at the end of 2023. Although the proportion is still small, it can be regarded as a major breakthrough for Samsung in the HBM field.
Since Samsung is AMD’s most important strategic supply partner for a long time, Samsung HBM3 products have also successively passed AMD MI300 series verification in the first quarter of 2024, including its 8h and 12h products. Therefore, since the first quarter of 2024 After this quarter, Samsung HBM3 products will gradually increase in volume.
Starting from 2024, the market focus will shift from HBM3 to HBM3e. It is expected that the volume will increase quarter by quarter in the second half of the year and gradually become the mainstream of the HBM market. According to TrendForce’s survey, SK Hynix took the lead in passing the verification in the first quarter, followed closely by Micron, which began to submit HBM3e mass production products at the end of the first quarter to match the NVIDIA H200 planned to be shipped at the end of the second quarter. .
Since Samsung submitted samples slightly later than the other two suppliers, it is expected that its HBM3e will pass the verification before the end of the first quarter and start in the second quarter. Officially shipped.
The original address of the report is attached to this website. Interested users can read it in depth.
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