Home Technology peripherals It Industry TrendForce: Nvidia's Blackwell platform products drive TSMC's CoWoS production capacity to increase by 150% this year

TrendForce: Nvidia's Blackwell platform products drive TSMC's CoWoS production capacity to increase by 150% this year

Apr 17, 2024 pm 08:00 PM
encapsulation TSMC semiconductor Nvidia cowos

News from this site on April 17, TrendForce recently released a report, believing that demand for Nvidia’s new Blackwell platform products is bullish, is expected to drive TSMC’s total CoWoS packaging production capacity to increase by more than 150% in 2024.

集邦咨询:英伟达 Blackwell 平台产品带动台积电今年 CoWoS 产能提高 150%

NVIDIA Blackwell’s new platform products include B-series GPUs and GB200 accelerator cards integrating NVIDIA’s own Grace Arm CPU.

TrendForce confirmed that the supply chain is currently very optimistic about GB200. It is estimated that shipments in 2025 are expected to exceed one million units, accounting for 40-50% of Nvidia's high-end GPUs.

NVIDIA plans to deliver products such as GB200 and B100 in the second half of the year, but upstream wafer packaging must further adopt CoWoS-L technology with more complex and high-precision requirements, and the verification and testing process will be more time-consuming, so TrendForce It is believed that related products will not start to increase in volume until the fourth quarter of this year or early next year.

CoWoS technology, as NVIDIA’s B series including GB200, B100, B200, etc. will consume more CoWoS production capacity, TSMC has also increased its CoWoS production capacity demand for the whole year of 2024, and it is estimated that the monthly production capacity will be close to the end of the year 4 million, an increase of more than 150% compared to the total production capacity in 2023.

In addition, the report believes that Nvidia and AI development, HBM3e will become the mainstream of the market in the second half of the year. The agency predicts that Nvidia will begin to expand shipments of H200 equipped with HBM3e in the second half of this year, replacing H100 as the mainstream. Later, GB200 and B100 will also adopt HBM3e.

集邦咨询:英伟达 Blackwell 平台产品带动台积电今年 CoWoS 产能提高 150%

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  • TrendForce TrendForce: NVIDIA Blackwell's new platform product demand is expected to increase, which is expected to drive TSMC's CoWoS total production capacity to increase by more than 150% in 2024

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According to news from this site on April 17, TrendForce recently released a report, believing that demand for Nvidia's new Blackwell platform products is bullish, and is expected to drive TSMC's total CoWoS packaging production capacity to increase by more than 150% in 2024. NVIDIA Blackwell's new platform products include B-series GPUs and GB200 accelerator cards integrating NVIDIA's own GraceArm CPU. TrendForce confirms that the supply chain is currently very optimistic about GB200. It is estimated that shipments in 2025 are expected to exceed one million units, accounting for 40-50% of Nvidia's high-end GPUs. Nvidia plans to deliver products such as GB200 and B100 in the second half of the year, but upstream wafer packaging must further adopt more complex products.

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