On April 24, Wall Street News reported that Honor CEO Zhao Ming revealed that Honor will be able to deploy a large AI model with a parameter scale of 7B (7 billion parameters) on the end-side of a 12GB memory smartphone in 2024.
Zhao Ming said that Honor’s platform-level AI technology can achieve ultra-high compression rates for large LLM models on the device side. The 7B model can start quickly on 12GB memory devices while ensuring that users’ commonly used application experience is not affected. According to previous reports, at the Honor MagicOS 8.0 conference held in January, Zhao Ming unveiled Honor’s self-developed 7 billion parameter platform-level AI model “Magic Model” on the device side, which was first launched by the Honor Magic 6 mobile phone.The above is the detailed content of Zhao Ming: Honor will be able to deploy a 7B device-side AI large model on a 12GB memory phone and ensure a smooth experience. For more information, please follow other related articles on the PHP Chinese website!