MemCache内存缓存笔记
一、Memcache简介 Memcache(内存,缓存) :是一个高性能的分布式的内存对象缓存系统。通过在内存里维护一个巨大的HashTable。由Memcached来管理这个巨大的HashTable。 二、Memcache 与 Memcached的区别 Memcache是软件名称,Memcached是启动后的进程名称。
一、Memcache简介
Memcache(内存,缓存) :是一个高性能的分布式的内存对象缓存系统。通过在内存里维护一个巨大的HashTable。由Memcached来管理这个巨大的HashTable。
二、Memcache 与 Memcached的区别
Memcache是软件名称,Memcached是启动后的进程名称。
三、Memcache工作原理
memcached是以守护程序方式运行于一个或多个服务器中,随时会接收客户端的连接和操作。
在没有安装memcache的时候网站工作的原理是:浏览器访问服务器脚本,然后服务器脚本访问数据库,处理后输出给浏览器。
而如果你的服务器安装了memcache的话,在执行了第一次数据库查询后,服务器脚本后把结果集存储到memcached内存缓存中,以后使用的时候就可不必查询数据库而是直接向memcached内存缓存索取,大大提高的效率。
四、安装Memcache服务器
wget http://memcached.googlecode.com/files/memcached-1.4.15.tar.gz tar -zxvf memcached-1.4.15.tar.gz cd memcached-1.4.15.tar.gz ./configure Make && make install
五、Memcached服务器启动时的基本设置
如:Memcahced –d –m 128 –l 192.168.1.111 –p 11211 –u root
下边是Memcahced 部分参数的说明
-p memcached监听的TCP端口
-l 连接的IP地址, 默认是本机
-d 以daemon方式运行,将程序放入后台
-u 以的身份运行 (仅在以root运行的时候有效)
-m 最大内存使用,单位MB。默认64MB ,最大好像2G
-M 内存耗尽时返回错误,而不是删除项
-c 最大同时连接数,默认是1024
-f 块大小增长因子,默认是1.25
-n 最小分配空间,key+value+flags默认是48
-h 显示帮助
原文地址:MemCache内存缓存笔记, 感谢原作者分享。

Hot AI Tools

Undresser.AI Undress
AI-powered app for creating realistic nude photos

AI Clothes Remover
Online AI tool for removing clothes from photos.

Undress AI Tool
Undress images for free

Clothoff.io
AI clothes remover

AI Hentai Generator
Generate AI Hentai for free.

Hot Article

Hot Tools

Notepad++7.3.1
Easy-to-use and free code editor

SublimeText3 Chinese version
Chinese version, very easy to use

Zend Studio 13.0.1
Powerful PHP integrated development environment

Dreamweaver CS6
Visual web development tools

SublimeText3 Mac version
God-level code editing software (SublimeText3)

Hot Topics



For mechanical hard drives or SATA solid-state drives, you will feel the increase in software running speed. If it is an NVME hard drive, you may not feel it. 1. Import the registry into the desktop and create a new text document, copy and paste the following content, save it as 1.reg, then right-click to merge and restart the computer. WindowsRegistryEditorVersion5.00[HKEY_LOCAL_MACHINE\SYSTEM\CurrentControlSet\Control\SessionManager\MemoryManagement]"DisablePagingExecutive"=d

According to the report, Samsung Electronics executive Dae Woo Kim said that at the 2024 Korean Microelectronics and Packaging Society Annual Meeting, Samsung Electronics will complete the verification of the 16-layer hybrid bonding HBM memory technology. It is reported that this technology has passed technical verification. The report also stated that this technical verification will lay the foundation for the development of the memory market in the next few years. DaeWooKim said that Samsung Electronics has successfully manufactured a 16-layer stacked HBM3 memory based on hybrid bonding technology. The memory sample works normally. In the future, the 16-layer stacked hybrid bonding technology will be used for mass production of HBM4 memory. ▲Image source TheElec, same as below. Compared with the existing bonding process, hybrid bonding does not need to add bumps between DRAM memory layers, but directly connects the upper and lower layers copper to copper.

According to news from this website on September 3, Korean media etnews reported yesterday (local time) that Samsung Electronics and SK Hynix’s “HBM-like” stacked structure mobile memory products will be commercialized after 2026. Sources said that the two Korean memory giants regard stacked mobile memory as an important source of future revenue and plan to expand "HBM-like memory" to smartphones, tablets and laptops to provide power for end-side AI. According to previous reports on this site, Samsung Electronics’ product is called LPWide I/O memory, and SK Hynix calls this technology VFO. The two companies have used roughly the same technical route, which is to combine fan-out packaging and vertical channels. Samsung Electronics’ LPWide I/O memory has a bit width of 512

According to news from this website on May 6, Lexar launched the Ares Wings of War series DDR57600CL36 overclocking memory. The 16GBx2 set will be available for pre-sale at 0:00 on May 7 with a deposit of 50 yuan, and the price is 1,299 yuan. Lexar Wings of War memory uses Hynix A-die memory chips, supports Intel XMP3.0, and provides the following two overclocking presets: 7600MT/s: CL36-46-46-961.4V8000MT/s: CL38-48-49 -1001.45V In terms of heat dissipation, this memory set is equipped with a 1.8mm thick all-aluminum heat dissipation vest and is equipped with PMIC's exclusive thermal conductive silicone grease pad. The memory uses 8 high-brightness LED beads and supports 13 RGB lighting modes.

According to news from this site on June 7, GEIL launched its latest DDR5 solution at the 2024 Taipei International Computer Show, and provided SO-DIMM, CUDIMM, CSODIMM, CAMM2 and LPCAMM2 versions to choose from. ▲Picture source: Wccftech As shown in the picture, the CAMM2/LPCAMM2 memory exhibited by Jinbang adopts a very compact design, can provide a maximum capacity of 128GB, and a speed of up to 8533MT/s. Some of these products can even be stable on the AMDAM5 platform Overclocked to 9000MT/s without any auxiliary cooling. According to reports, Jinbang’s 2024 Polaris RGBDDR5 series memory can provide up to 8400

According to a TrendForce survey report, the AI wave has a significant impact on the DRAM memory and NAND flash memory markets. In this site’s news on May 7, TrendForce said in its latest research report today that the agency has increased the contract price increases for two types of storage products this quarter. Specifically, TrendForce originally estimated that the DRAM memory contract price in the second quarter of 2024 will increase by 3~8%, and now estimates it at 13~18%; in terms of NAND flash memory, the original estimate will increase by 13~18%, and the new estimate is 15%. ~20%, only eMMC/UFS has a lower increase of 10%. ▲Image source TrendForce TrendForce stated that the agency originally expected to continue to

When the prices of ultra-high-frequency flagship memories such as 7600MT/s and 8000MT/s are generally high, Lexar has taken action. They have launched a new memory series called Ares Wings ARES RGB DDR5, with 7600 C36 and 8000 C38 is available in two specifications. The 16GB*2 sets are priced at 1,299 yuan and 1,499 yuan respectively, which is very cost-effective. This site has obtained the 8000 C38 version of Wings of War, and will bring you its unboxing pictures. The packaging of Lexar Wings ARES RGB DDR5 memory is well designed, using eye-catching black and red color schemes with colorful printing. There is an exclusive &quo in the upper left corner of the packaging.

According to news on May 6, vivo officially announced today that the new vivoX100 series will be officially released at 19:00 on May 13. It is understood that this conference is expected to release three models, vivoX100s, vivoX100sPro, and vivoX100Ultra, as well as vivo's self-developed imaging brand BlueImage blueprint imaging technology. Digital blogger "Digital Chat Station" also released the official renderings, memory specifications and color matching of these three models today. Among them, X100s adopts a straight screen design, while X100sPro and X100Ultra have curved screen designs. The blogger revealed that vivoX100s comes in four colors: black, titanium, cyan, and white. The memory specifications
